Temperature fields developing in the process of cutting of sapphire and diamond

Bogdanovich, P. N.; Tkachuk, D. V.; Bliznets, D. A.

doi:10.1007/s10891-009-0221-x

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“…For example, the thermal processes occurring during frictional contact are studied in [8,9]. At the present time, only some phenomena observed during the sawing of workpieces from hard and ultra-hard materials have been studied [10,11,12].…”

Section: Introductionmentioning

confidence: 99%

Theoretical and Experimental Analysis of the Sawing Process for Hard and Ultra-Hard Materials

Bogdanovich¹,

Bliznets²,

Shimanovsky³

et al. 2016

IJMERR

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The justification of the correctness of the selected regimes for silicate glass, leucosapphire, and diamondite sawing based on the finite element modeling of friction node deformation is given. The natural oscillation frequencies for the shaft with the saw disk and the forms of stability loss are observed. The analysis of the temperature fields recorded during the sawing process is performed for the hardest sample (diamond). The nature of destruction for the side surfaces of the sawn pieces is analyzed. 

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