Wear of inorganic materials upon wafering using an abrasive tool

Bliznets, D. A.; Bogdanovich, P. N.

doi:10.3103/s1068366616060039

Cited by 2 publications

(1 citation statement)

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“…One of the main problems in the mechanical splitting of workpieces is the curvature of the disk shape under increased load and the speed of rotation. In this case, there is the possibility of the side surfaces of the sawn workpiece interacting with the curvilinear surface of the disk, causing pulse-changing cyclic temperature and mechanical stresses that lead to workpiece fatigue cracks propagating perpendicular to the cutting surface and deteriorating its quality [5]. The presence of cracks and areas of chipping in the workpiece material require the removal of a sufficiently thick layer during follow-up Manuscript received October 8, 2017; revised January 11, 2018. operations.…”

Section: Introductionmentioning

confidence: 99%

Theoretical and Experimental Analysis of the Sawing Process for Hard and Ultra-Hard Materials

Bogdanovich¹,

Bliznets²,

Shimanovsky³

et al. 2016

IJMERR

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The justification of the correctness of the selected regimes for silicate glass, leucosapphire, and diamondite sawing based on the finite element modeling of friction node deformation is given. The natural oscillation frequencies for the shaft with the saw disk and the forms of stability loss are observed. The analysis of the temperature fields recorded during the sawing process is performed for the hardest sample (diamond). The nature of destruction for the side surfaces of the sawn pieces is analyzed. 

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Section: Introductionmentioning

confidence: 99%