Temperature field in a half-space with a foreign inclusion

Thermal simulation of heterogeneous structural components in microelectronic devices

“…The original nonlinear heat conductivity equation (1) has been partially linearized using the relation 3 of the strip with the expressions (7) that allowed to totally linearize the nonlinear boundary problem of thermal conductivity (5), (6) for a thermosensitive system with the foreign inclusion. An analytical solution to the input function  has been produced as a formula (3), which enabled to construct new algorithms and developed software to evaluate the temperature gradients in the area of foreign inclusion and to forecast the operation mode of electronic devices with increased thermal resistance and prolonged operating period.…”

“…The approximate analytical solution for half-space with a small foreign heat dissipating cylindrical inclusion was obtained in the paper [1]. The analytical solution for the isotropic strip with the rectangular inclusion of an arbitrary size is produced in the paper [2].…”