Temperature distribution in polishing pad during CMP process: Effect of retaining ring

Abstract

Heat generation is inevitable during the chemical mechanical planarization (CMP) process because the mechanical and chemical removal of material is carried out by using abrasives and chemicals in the CMP slurry. In this paper, results obtained from experiments performed on a membrane-type carrier having a retaining ring were used to study the temperature distribution in a polishing pad during the CMP process. To understand and predict the distribution of temperature rise, a kinematical analysis of the temperature distribution was performed by considering the frictional characteristics of the process. The results of this study can be used to predict the temperature distribution in a polishing pad, and such predictions can help in developing a more effective CMP process.

Development of green CMP by slurry reduction through controlling platen coolant temperature

“…Kim et al 12 showed that the contact area increases with temperature caused by the decrease of asperity hardness due to the temperature elevation. Lee et al 13 showed that the rise of the pad temperature increases the temperature of the slurry flow in the pad-substrate interface. In our experiment, the platen coolant temperature is adjusted from 10 to 30 o C to verify the effect of elevating pad temperature in the process.…”