2010
DOI: 10.1557/jmr.2010.0159
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Temperature dependence of the indentation size effect

Abstract: The influence of temperature on the indentation size effect is explored experimentally. Copper is indented on a custom-built high-temperature nanoindenter at temperatures between ambient and 200 °C, in an inert atmosphere that precludes oxidation. Over this range of temperatures, the size effect is reduced considerably, suggesting that thermal activation plays a major role in determining the length scale for plasticity.

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Cited by 49 publications
(37 citation statements)
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References 28 publications
(20 reference statements)
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“…(4). At high temperatures, the dynamic recovery by dislocation annihilation is expected to be significant, which explains why the high temperature indentation on Cu in the work of Franke et al 18 exhibits a similar trend as W and Al, but more pronounced temperature effect ($3.5 times increase in h à ef f from 296 to 473 K). Because the cross-slip probability has an exponential dependence on temperature, the mechanical recovery rate would be more rapid at the higher temperature even though Cu (44.6 mJ/m 2 ) has the stacking fault energy lower than Al (145.5 mJ/m 2 ).…”
Section: à2mentioning
confidence: 95%
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“…(4). At high temperatures, the dynamic recovery by dislocation annihilation is expected to be significant, which explains why the high temperature indentation on Cu in the work of Franke et al 18 exhibits a similar trend as W and Al, but more pronounced temperature effect ($3.5 times increase in h à ef f from 296 to 473 K). Because the cross-slip probability has an exponential dependence on temperature, the mechanical recovery rate would be more rapid at the higher temperature even though Cu (44.6 mJ/m 2 ) has the stacking fault energy lower than Al (145.5 mJ/m 2 ).…”
Section: à2mentioning
confidence: 95%
“…For W and Al, both showed the opposite trend, and a similar experimental finding of higher h à ef f at lower temperatures was recently reported in high-temperature nanoindentation on Cu. 18 This Cu work mentioned the temperature-dependent storage volume for the GNDs to explain their temperature effects. [18][19][20] The size of the plastic zone as well as the storage volume could be affected by dislocation mechanisms, which could be different with material parameter and temperature.…”
mentioning
confidence: 99%
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“…Using elevated temperature nanoindentation, Franke et al [50] investigated the indentation size effect in copper up to 200 °C (0.348 T m ) and observed a significant decrease in magnitude at elevated temperature, in contrast to microcompression results of Al at similar homologous temperatures. Therefore, the aim of the present paper is to systematically investigate the plasticity of FCC pillar structures at the micron and sub-micron regimes, for the first time, at elevated temperatures up to 400 °C (0.495 T m ).…”
Section: Introductionmentioning
confidence: 99%