1995
DOI: 10.1109/16.381974
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Temperature dependence of breakdown voltages in separate absorption, grading, charge, and multiplication InP/InGaAs avalanche photodiodes

Abstract: Abstruct-In this paper, we investigate temperature dependence of breakdown voltage Ii,? from -40 to 110°C in separate absorption, grading, charge, and multiplication (SAGCM) InPnnGaAs avalanche photodiodes (APD's) with a range of device parameters. The experimental data shows that I/br is approximately a linear function of temperature, with a temperature coefficient qeXp between 0.13 and 0.16 V/"C. A physical model is developed and it demonstrates that I;,. indeed varies linearly with temperature with a temper… Show more

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Cited by 58 publications
(26 citation statements)
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“…Increasing the operating temperature from 23C to 90C has been shown to result in more than one order of magnitude increase in the dark current at a multiplication gain of 10. The extraction shows a δ value of 15mV/K, which is merely less than half of that obtained in a typical III-V based APD made of InP/InGaAs compound semiconductors (Ma et al, 1995). This makes Si a preferred material to meet the stringent requirement for thermal stability in APD receiver as it exhibits the least temperature sensitivity for breakdown voltage.…”
Section: Ge/si Avalanche Photodetector Design and Fabricationmentioning
confidence: 85%
“…Increasing the operating temperature from 23C to 90C has been shown to result in more than one order of magnitude increase in the dark current at a multiplication gain of 10. The extraction shows a δ value of 15mV/K, which is merely less than half of that obtained in a typical III-V based APD made of InP/InGaAs compound semiconductors (Ma et al, 1995). This makes Si a preferred material to meet the stringent requirement for thermal stability in APD receiver as it exhibits the least temperature sensitivity for breakdown voltage.…”
Section: Ge/si Avalanche Photodetector Design and Fabricationmentioning
confidence: 85%
“…Ука-занные возможности открывают принципиально новые перспективы для создания оптоэлектронных устройств и приборов. Применение подобных гетероструктур в оптоэлектронике выдвигает повышенные требования к их составу и кристаллическому качеству [3][4][5][6].…”
Section: Introductionunclassified
“…Disadvantages of hybrid assembly concept include complex electrical interconnections between the CMOS electronics and optical components. Also, the bonding processes for hybrid integration should be further optimized to improve their compatibility with different types of components to be integrated [40,154].…”
Section: Hybrid Integrationmentioning
confidence: 99%