2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits 2010
DOI: 10.1109/ipfa.2010.5531987
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Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages

Hakan Kör
1
,
Aolei Chang
2
,
Chee Lip Gan
3

Abstract: Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages

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