Proceedings of the 13th ACM Great Lakes Symposium on VLSI 2003
DOI: 10.1145/764808.764829
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TEM-cell and surface scan to identify the electromagnetic emission of integrated circuits

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Cited by 14 publications
(10 citation statements)
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“…With the increase of the integration density of the modern electrical and electronic systems, the analysis of electromagnetic interference (EMI) and electromagnetic compatibility (EMC) issues become one of the primary importance and unavoidable step during the design process [1][2][3][4][5][6][7]. This effect can be found in various stages of the different chains for example in the automotive vehicles or aeronautic engines [8][9][10][11][12].…”
Section: Introductionmentioning
confidence: 99%
“…With the increase of the integration density of the modern electrical and electronic systems, the analysis of electromagnetic interference (EMI) and electromagnetic compatibility (EMC) issues become one of the primary importance and unavoidable step during the design process [1][2][3][4][5][6][7]. This effect can be found in various stages of the different chains for example in the automotive vehicles or aeronautic engines [8][9][10][11][12].…”
Section: Introductionmentioning
confidence: 99%
“…With the emergence of the hybrid technology integrated with multifunction, the issues related to the electromagnetic interference (EMI) [1][2][3][4][5][6][7][8][9] and electromagnetic compatibility (EMC) [10][11][12][13][14] become a primary importance during the manufacturing of the electrical and electronic circuits. The incessant technological development is currently known with systems integrating more and more different hybrid functions in a confine space.…”
Section: Introductionmentioning
confidence: 99%
“…To forecast this unwanted phenomenon, investigations of near-field (NF) characterization were conducted [11][12][13][14][15][16][17].…”
Section: Introductionmentioning
confidence: 99%