Technology Trends: Past, Present, and Future

Perfecto, Eric; Srivastava, K.K.

doi:10.1007/978-1-4419-5768-9_2

Cited by 3 publications

(3 citation statements)

References 21 publications

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“…Today, the typical pitch distance of the ball grid arrays (BGA) is ranged at 0.4-1.0 mm, while that of flip chip or controlled collapse chip connection (C4) is as short as 0.1-0.15 mm. 124,125 Researchers have carried out tremendous amount of work to understand the effects of spacing on the ECM behaviour as the decreased spacing is one of the drivers for ECM. It was reported that the time required for the initial step of ECM depends on the spacing between two adjacent electrodes.…”

Section: Flux Of Ions Ion Drift Velocity Concentration Of Ions 13mentioning

confidence: 99%

Review—Electrochemical Migration in Electronic Materials: Factors Affecting the Mechanism and Recent Strategies for Inhibition

Lee

Goh

Haseeb

et al. 2023

J. Electrochem. Soc.

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Electrochemical migration (ECM) is one of the serious failure modes encountered in electronic devices due to the electrochemical reactions triggered by the presence of moisture and bias voltage, leading to the growth of dendrites and short circuits. The classical ECM mechanism consists of four consecutive stages: (i) electrolyte formation, (ii) anodic dissolution, (iii) ion transport, and (iv) dendrite growth. ECM is a delicate process that involves a combination of a good number of factors, such as the electrode properties, climatic conditions, contaminants, electric field, additives, etc. We intend to provide a comprehensive review of the complex effects that these factors have on each stage of ECM and provide insights into the recent developments in ECM research. Previous findings, current debates and recent discoveries are covered in this article. This review paper also provides a review of recent strategies for ameliorating ECM failures in electronics.

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Section: Flux Of Ions Ion Drift Velocity Concentration Of Ions 13mentioning

confidence: 99%

Review—Electrochemical Migration in Electronic Materials: Factors Affecting the Mechanism and Recent Strategies for Inhibition

Lee

Goh

Haseeb

et al. 2023

J. Electrochem. Soc.

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“…To understand the effect of the UBM on the XRF reading, two UBM stacks were prepared containing a thick Cu UBM or no Cu UBM. In order to setup and calibrate the XRF settings, C4NP standards were constructed [2]. C4NP is a solder transfer process which controls the Ag% composition to ± 0.1%Ag.…”

Section: Sample Preparationmentioning

confidence: 99%

Assessment of XRF Technique as a Method to Measure Percent Ag in SnAg Solders for Flip Chip Applications

Schuler

Shih²,

Arvin

et al. 2012

International Symposium on Microelectronics

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Pb-free SnAg solder has become the industry standard for fabricating flip chip interconnects utilizing C4 (controlled collapse chip connection) technology. One area of interest for manufacturability of Pb-free solders is the ability to control and measure the %Ag composition and its variation from wafer to wafer, chip to chip, and C4 to C4. There are various ways to measure solder composition. These are divided into two categories which are invasive and non-invasive referring to whether solder must be removed from the wafer in order to conduct the measurement. There are a variety of invasive methods including Atomic Absorption (AA), Differential Scanning Calorimetry (DSC), Inductively Coupled Plasma (ICP) and Electron Probe Micro-Analyzer (EPMA) used with cross sections. Non-invasive methods are limited, making the development of the non-invasive X-Ray Fluorescence (XRF) method an important technique to determine both the thickness and composition of C4s on wafers without modifying the wafer. There are many factors which can affect the accuracy of the XRF measurements. These include bump geometry, composition, UBM (under bump metallurgy) stack, bump spatial density, underlying chip wiring, tool vibration and tool parameters, such as collimator size, power levels, scan time, etc. This paper will address the implementation issues in utilizing XRF for Pb-free solder SnAg systems. The paper will describe:(1) Experimental bumping variables,(2) XRF configuration, calibration, optimized measuring methodology and the importance of having known standards with the same dimensions of the bumps being measured(3) Measuring accuracy and correlation with ICP and DSC,(4) Ag distribution study in the die and wafer level

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“…This avoids the requirement for complex encapsulation patterning techniques that we have previously needed for wire-bonded (face-up) implantable sensors [17]. In a typical rigid flip-chip assembly process, metallic bumps are applied to the die, followed by die alignment and bonding to the substrate pads, and finally application of an underfill to insulate and support the bonds [18]. In FCOF assembly, non-conductive or anisotropic conductive adhesives can be used to form the bonds [19], however we opted to retain conventional gold stud bumping and thermosonic bonding to maximise bond strength [20].…”

Section: Introductionmentioning

confidence: 99%

Toward Synthetic Vascular Graft Monitoring Using a Flip-Chip-on-Flex Impedance Spectroscopy Sensor

et al. 2023

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Synthetic vascular grafts are used in a wide range of clinical applications. However, they can become prone to occlusion over time, due to growth of vascular smooth muscle cells (VSMC). This phenomenon is associated with graft failure. Here, we describe novel techniques for packaging and integration of a miniature sensor of VSMC growth. The sensor was based on a microfabricated array of interdigitated platinum electrodes on a silicon substrate. It was assembled using flip-chip-on-flex technology to create a low-profile package that can be manufactured using industry-standard tools and is suitable for integration with a synthetic vascular graft. The packaged sensor responded to changes in solution impedance, and accurately detected growth of VSMC in vitro. We also demonstrated successful proof-of-concept integration of the sensor with a custom synthetic graft. Together these technologies have the potential to allow early detection of VSMC growth prior to graft occlusion, enabling more timely and effective clinical interventions to be made.

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Technology Trends: Past, Present, and Future

Cited by 3 publications

References 21 publications

Review—Electrochemical Migration in Electronic Materials: Factors Affecting the Mechanism and Recent Strategies for Inhibition

Review—Electrochemical Migration in Electronic Materials: Factors Affecting the Mechanism and Recent Strategies for Inhibition

Assessment of XRF Technique as a Method to Measure Percent Ag in SnAg Solders for Flip Chip Applications

Toward Synthetic Vascular Graft Monitoring Using a Flip-Chip-on-Flex Impedance Spectroscopy Sensor

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