Abstract:Pb-free SnAg solder has become the industry standard for fabricating flip chip interconnects utilizing C4 (controlled collapse chip connection) technology. One area of interest for manufacturability of Pb-free solders is the ability to control and measure the %Ag composition and its variation from wafer to wafer, chip to chip, and C4 to C4.
There are various ways to measure solder composition. These are divided into two categories which are invasive and non-invasive referring to whether solder m… Show more
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