Techniques for Early Package Closure in System-in-Packages

Vaidyanathan, Swarnagowri; Brahme, Amit; Jairam, S.

doi:10.1109/isqed.2008.4479807

9th International Symposium on Quality Electronic Design (Isqed 2008) 2008

DOI: 10.1109/isqed.2008.4479807

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Techniques for Early Package Closure in System-in-Packages

Swarnagowri Vaidyanathan

Amit Brahme

S. Jairam

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Chip-package-board co-design for complex System-on-Chip (SoC)

Patil¹,

Brahme²,

Shust³

et al. 2010

2010 IEEE Electrical Design of Advanced Package &Amp; Systems Symposium

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Techniques for Early Package Closure in System-in-Packages

Cited by 3 publications

References 2 publications

Chip-package-board co-design for complex System-on-Chip (SoC)

Chip-package-board co-design for complex System-on-Chip (SoC)

Chip-package-board co-design for complex system-on-chip (SoC)

Early stage chip/package/board co-design techniques for system-on-chip

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