Chip-package-board co-design for complex System-on-Chip (SoC)

Patil, Mahendrasing; Brahme, Amit; Shust, Michael; Coates, Keven; Thatte, Shubhada; Soman, Sreekanth

doi:10.1109/edaps.2010.5683017

2010 IEEE Electrical Design of Advanced Package &Amp; Systems Symposium 2010

DOI: 10.1109/edaps.2010.5683017

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Chip-package-board co-design for complex System-on-Chip (SoC)

Mahendrasing Patil¹,

Amit Brahme²,

Michael Shust³

et al.

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Chip-package-board co-design for complex System-on-Chip (SoC)

Cited by 1 publication

References 1 publication

Package Design Methodology for Crosstalk Mitigation between DC/DC Converter and ADC Analog Inputs in Complex SoC

Package Design Methodology for Crosstalk Mitigation between DC/DC Converter and ADC Analog Inputs in Complex SoC

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