Technical evaluation of a near chip scale size flip chip/plastic ball grid array package

Jimarez, Miguel; Li, Li; Tytran, C.; Loveland, C.; Obrzut, Jan

doi:10.1109/ectc.1998.678739

Cited by 4 publications

(1 citation statement)

References 3 publications

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“…Microvia will save PCB real-estate. Combining with via-in-pad (VIP) they will save even more (Jimarez et al, 1998;Mawer et al, 1998;Lau et al, 1999). Figure 14 shows a cross-section of a solder bumped flip chip on the microvia in pad on an organic substrate (Lau et al, 1999).…”

Section: Microvia In Padsmentioning

confidence: 99%

An overview of microvia technology

Lau¹,

Chang²

2000

Circuit World

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There are many advantages of microvia: it requires a much smaller pad, which saves the board size and weight; with microvia, more chips can be placed in less space or a smaller PCB, which results in a low cost; and with microvia, electrical performance improves due to a shorter pathway. Basically, there are five major processes for microvia formation: NC drilling; laser via fabrication including CO2 laser, YAG laser, and excimer; photo‐defined vias, wet or dry; etch via fabrications including chemical (wet) etching and plasma (dry) etching; and conductive ink formed vias, wet or dry. This paper will discuss the materials and processes of these five major microvia formation methods. At the end, eight key manufacturers from Japan will be briefly illustrated for their research status and current capability of producing smallest microvia.

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Section: Microvia In Padsmentioning

confidence: 99%