2021
DOI: 10.3389/fphy.2021.617322
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TCAD Modeling of Surface Radiation Damage Effects: A State-Of-The-Art Review

Abstract: A comprehensive numerical model which accounts for surface damage effects induced by radiation on silicon particle detectors is presented with reference to the state-of-the-art Synopsys Sentaurus Technology CAD (TCAD) tool. The overall aim of this work is to present the “Perugia 2019 Surface” damage modeling scheme, fully implemented within the TCAD environment, which effectively describes the surface damage effects induced by radiation in silicon sensors relying on a limited number of parameters relevant for … Show more

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Cited by 18 publications
(16 citation statements)
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“…In the original Perugia model [10,22], a three level model is presented for simulating the bulk damage effects for n-type and p-type substrates. In order to incorporate also the surface damage effects an extension of the model has been made refereed to as the Perugia surface model 2019 [23,24]. The surface damage effects can be mainly described by three parameters: the oxide charge density (N ox ) and the two interface trap states (N it ) for donors and acceptors.…”
Section: Tcad Simulations For Detector Propertiesmentioning
confidence: 99%
“…In the original Perugia model [10,22], a three level model is presented for simulating the bulk damage effects for n-type and p-type substrates. In order to incorporate also the surface damage effects an extension of the model has been made refereed to as the Perugia surface model 2019 [23,24]. The surface damage effects can be mainly described by three parameters: the oxide charge density (N ox ) and the two interface trap states (N it ) for donors and acceptors.…”
Section: Tcad Simulations For Detector Propertiesmentioning
confidence: 99%
“…Although these models can describe the DC and AC characteristics of the circuit, it is difficult to describe the ESD effect of the device unless the model parameters are extracted by special experimental tests [ 13 ]. Technology computer-aided design (TCAD) can effectively describe the transient large-signal characteristics of components or the degradation characteristics under extreme conditions according to the physical characteristics of semiconductor devices, and it is generally applied based on physical principles [ 9 , 14 ]. With the development of computer technology, the calculation level of TCAD is improved, which can solve complex numerical models [ 15 , 16 , 17 ].…”
Section: Introductionmentioning
confidence: 99%
“…The intense x-ray radiation deteriorates the Si detector performance by inducing the fixed oxide charges (Nox) and interface trap charges (Nit) in the insulating layer and at Si-SiO2 interface respectively [2,6] and these charges increases with an increasing x-ray dose and finally, saturates at few MGy of x-ray dose [6,8]. These radiation damage parameters changes the macroscopic performance of the the detector by increasing full depletion voltage (Vfd), surface leakage current, inter strip capacitance, reduction of breakdown voltage and charge lose at the interface of the detector.…”
Section: Introductionmentioning
confidence: 99%