Tape on substrate, a new systems approach for manufacturing multilayer hybrid circuits

Patterson, F.K.; Gantzhorn, J.E.; Daly, T.P.; Rellick, J. R.; Iwabuchi, M.; Kawasaki, Shigeo

doi:10.1109/iemts.1989.76126

Cited by 4 publications

(5 citation statements)

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“…The Si-side is facing upwards in the sintering furnace to prevent the flow of the softening ceramic into the Si-cavities during the sintering phase. After sintering post-processing including cleaning steps, ultrasonic microscopy, X-ray examination and wafer-bow measurement at wafer-level (11) are carried out. Finally, the wafer is separated into individual 2 mm x 2 mm sensor elements using wafer sawing (12).…”

Section: A Previous Manufacturing Methodsmentioning

confidence: 99%

“…In order to maintain the yield of the sensor elements on the wafer, a modified process based on the tape-on-substrate method [11] was developed parallel to the sinter optimization. For the modified SiCer approach, two separately fabricated substrates were bonded with an additional unsintered ceramic layer by laminating and sintered a second time to form a SiCer substrate (Substrate-on-Tape-on-Substrate, SoToS).…”

Section: E Modified Sicer Approach: Substrate-on-tape-on-substrate (S...mentioning

confidence: 99%

See 1 more Smart Citation

Innovative Silicon-Ceramic (SiCer) Technology for High-Strength Pressure Sensor Applications Using Different Manufacturing Methods

Kleinholz,

Fischer,

Gutzeit

et al. 2024

IMAPSource Proceedings

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A variety of manufacturing methods can be used to assemble silicon-based piezoresistive pressure sensors, such as anodic bonding or silicon direct bonding. To achieve highstrength pressure sensors, a high quality interface connection is required. The combination of silicon and ceramic creates a new innovative composite system known as Silicon-on-Ceramics, short SiCer. By using a special developed bondable Low Temperature Co-fired Ceramic tape, which corresponds to the thermal expansion coefficient of Si, the combination of both materials is possible through a sintering process. Advantages of the SiCer technology are high temperature stability, manufacturing at wafer-level and a high bond strength at the interface. Different manufactured SiCer-based pressure sensors were fabricated, electrically and mechanically characterized and compared with anodic bonded and silicon direct bonded pressure sensors.

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Section: A Previous Manufacturing Methodsmentioning

confidence: 99%

Section: E Modified Sicer Approach: Substrate-on-tape-on-substrate (S...mentioning

confidence: 99%

Innovative Silicon-Ceramic (SiCer) Technology for High-Strength Pressure Sensor Applications Using Different Manufacturing Methods

Kleinholz,

Fischer,

Gutzeit

et al. 2024

IMAPSource Proceedings

View full text Add to dashboard Cite

show abstract

“…In order to adapt the nanolayer pile to the rough surface of the LTCC substrate, a dielectric layer is printed on top, as per Figure 2, with a cross section of the reactive multilayer on an LTCC substrate being shown in Figure 3 complete with a GreenTape TM DuPont (DP) 951 isolation layer. Figure 2 shows the formation required for a so-called tape-on-substrate (TOS) process [26], and furthermore, screen-printed dielectric paste is added to the fired substrate, which then requires a brief drying step and an additional 2 h sintering process.…”

Section: Introductionmentioning

confidence: 99%

“…a so-called tape-on-substrate (TOS) process [26], and furthermore, screen-printed dielectric paste is added to the fired substrate, which then requires a brief drying step and an additional 2 h sintering process. Figure 4 shows a cross-section performed on one of these LTCC substrates with similar embedded temperature probe structures using light microscopy.…”

Section: Introductionmentioning

confidence: 99%

“…The localised heat release causes the solder to melt, and thereafter, once the reaction has expired, the structures cool down. The purpose of the simulations is to determine the effect of adding solder layers upon reactive multilayer films and to offer guidelines as to how these would potentially be interpreted by temperature instrumentation in a similar laboratory a so-called tape-on-substrate (TOS) process [26], and furthermore, screen-printed dielectric paste is added to the fired substrate, which then requires a brief drying step and an additional 2 h sintering process. Figure 4 shows a cross-section performed on one of these LTCC substrates with similar embedded temperature probe structures using light microscopy.…”

Section: Introductionmentioning

confidence: 99%

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The Simulated Effect of Adding Solder Layers on Reactive Multilayer Films Used for Joining Processes

et al. 2022

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In order to introduce new bonding methods in the area of electronic packaging a theoretical analysis was conducted, which should give substantial information about the potential of reactive multilayer systems (rms) to create sufficient local heat for joining processes between silicon chips and ceramic substrates. For this purpose, thermal CFD (computational fluid dynamics) simulations have been carried out to simulate the temperature profile of the bonding zone during and after the reaction of the rms. This thermal analysis considers two different configurations. The first configuration consists of a silicon chip that is bonded to an LTCC-substrate (Low Temperature Co-fired Ceramics) using a bonding layer that contains an rms and a solder preform. The reaction propagation speed of the reactive multilayer was set to a value of 1 m/s, in order to partially melt a solder preform underneath a silicon chip. The second configuration, which consists only of the LTCC-substrate and the rms, was chosen to study the differences between the thermal outputs of the two arrangements. The analysis of the CFD simulations was particularly focused on interpretations of the temperature and liquid fraction contours. The CFD thermal simulation analysis conducted contains a melting/solidification model which can track the molten/solid state of the solder in addition to modelling the influence of latent heat. To provide information for the design of a test-substrate for experimental investigations, the real behaviour of Pt-100 temperature probes on the LTCC-substrate was simulated, in order to monitor an actual bonding in the experiment. All simulations were carried out using the ANSYS Fluent software.

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Analysis of selective bonding processes using reactive multi-layers for system integration on LTCC based SiPs

et al. 2022

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This paper discusses the use of reactive multi-layers for selective assembly of ICs (Integrated Circuits) in an LTCC (Low Temperature Co-fired Ceramics) based SiP (System-in-Package). To understand the requirements for the use of self-propagating reactive multilayers in die bonding, CFD (Computational Fluid Dynamics) simulations have been carried out to simulate the die bonding process of a silicon chip onto a ceramic LTCC substrate. Reactive foils of 40 and 80 µm thicknesses and a simulated reaction propagation speed of 1 m/s were studied and used to melt a solder preform underneath a silicon chip. The results of the CFD simulations were analysed, particularly with respect to temperature and liquid fraction contours, as well as time–temperature histories obtained from temperature probes which were included in the model, such as to approximate the real behaviour of Pt-100 temperature probes, when a real bonding process is being tracked. The CFD method, in this instance realised with ANSYS Fluent software, can track the melting and solidification of the solder as well as model the influence of latent heat, which is crucial to ascertaining the true evolution of the bonding process.

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Tape on substrate, a new systems approach for manufacturing multilayer hybrid circuits

Cited by 4 publications

References 0 publications

Innovative Silicon-Ceramic (SiCer) Technology for High-Strength Pressure Sensor Applications Using Different Manufacturing Methods

Innovative Silicon-Ceramic (SiCer) Technology for High-Strength Pressure Sensor Applications Using Different Manufacturing Methods

The Simulated Effect of Adding Solder Layers on Reactive Multilayer Films Used for Joining Processes

Analysis of selective bonding processes using reactive multi-layers for system integration on LTCC based SiPs

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