2019
DOI: 10.1016/j.surfcoat.2019.124906
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Tailoring of TiO2 film microstructure by pulsed-DC and RF magnetron co-sputtering

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Cited by 20 publications
(8 citation statements)
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“…The rutile phase is formed in the MSPVD coatings, despite the relatively low temperature of the deposition process under specific process conditions, particularly with high magnetron power. Reference [34] contains similar dependencies. The titanium oxide layer obtained on the surface of the tested materials by the ALD method shows an amorphous structure, as evidenced by a slightly blurred microscopic image from this area (Figure 3b), characteristic of this type of atomic structure.…”
Section: Resultsmentioning
confidence: 99%
“…The rutile phase is formed in the MSPVD coatings, despite the relatively low temperature of the deposition process under specific process conditions, particularly with high magnetron power. Reference [34] contains similar dependencies. The titanium oxide layer obtained on the surface of the tested materials by the ALD method shows an amorphous structure, as evidenced by a slightly blurred microscopic image from this area (Figure 3b), characteristic of this type of atomic structure.…”
Section: Resultsmentioning
confidence: 99%
“…It not only has small absorption of visible light but also can absorb, scatter, or reflect a large amount of ultraviolet rays harmful to people and objects. At the same time, to prevent corrosion of Mo layer caused by oxygen and other substances at high temperature, tungsten trioxide, an N-type semiconductor metal oxide that has stable properties and excellent photoelectric conversion performance and photocorrosion resistance, can make more effective use of solar radiation energy (Álvarez-Fraga et al, 2014;Lelis et al, 2019;Firat, 2021).…”
Section: Resultsmentioning
confidence: 99%
“…In comparison to evaporation plating and ion plating, sputtering has a lower deposition rate of 25-1000 nm min À1 as the deposited species should be ejected from a condensedmatter source by the impingement of energetic projectile particles. [452,453] However, some ceramics and refractory metals (i.e., having high melting points), which are difficult to deposit by evaporation plating, are prone to deposit by sputtering. Therefore, sputtering is a popular method that exhibits many advantages, including versatility and flexibility.…”
Section: Physical Vapor Depositionmentioning
confidence: 99%