2021
DOI: 10.1109/tmtt.2021.3057644
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Systematic Design Procedure for Y-Junction Circulator Based on Ridge Gap Waveguide Technology

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Cited by 15 publications
(6 citation statements)
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“…Recently, there has been great interest in designing ferrite circulators using closed-form solutions. For instance, a disclosure design methodology based on a modified boundary condition and an expression for the closed form solution of the strip-line Y-junction was studied in [34] and [35]. The presented techniques can be considered an efficient method for circulator design, but they have several limitations: two unknown variables need to be estimated, a material with a high dielectric constant needs to be assumed, and most of the equations and state-of-the-arts were less simplified.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, there has been great interest in designing ferrite circulators using closed-form solutions. For instance, a disclosure design methodology based on a modified boundary condition and an expression for the closed form solution of the strip-line Y-junction was studied in [34] and [35]. The presented techniques can be considered an efficient method for circulator design, but they have several limitations: two unknown variables need to be estimated, a material with a high dielectric constant needs to be assumed, and most of the equations and state-of-the-arts were less simplified.…”
Section: Introductionmentioning
confidence: 99%
“…With the rapid development of microwave circuit technology, circulators are increasingly demanding miniaturization. Integration, wide bandwidth, and high power capacity 1–6 . These nonreciprocal devices are used to transmit and isolate signals.…”
Section: Introductionmentioning
confidence: 99%
“…Integration, wide bandwidth, and high power capacity. [1][2][3][4][5][6] These nonreciprocal devices are used to transmit and isolate signals. However, these devices are pretty bulky, limiting industrial applications, especially in future miniaturized high power radar applications.…”
Section: Introductionmentioning
confidence: 99%
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“…Besides Dk and Df, the electrical performances of designed circuits are related to some other parameters of CCL, such as the moisture absorption, thermal coefficient, copper peel, and so on, and even the CCL manufacturing process, especially for the frequency of millimeter‐wave or terahertz bands. In recent years, the researchers mainly focus on some areas for circuit performance improvements, such as the performance investigation for accurate design of various circuits, 1,2 flexion modification for flexible or conformal applications, 3–5 improvement of manufacturing process, 6,7 usage of advanced material, 8 and gap waveguide technique 9,10 . It is known that the adhesive layer is normally necessary in traditional lamination process, which is composed of epoxy and acrylic resin.…”
Section: Introductionmentioning
confidence: 99%