2022
DOI: 10.1063/5.0099170
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System-on-chip approach microwave imaging reflectometer on DIII-D tokamak

Abstract: System-on-chip millimeter wave integrated circuit technology is used on the two-dimensional millimeter-wave imaging reflectometer (MIR) upgrade for density fluctuation imaging on the DIII-D tokamak fusion plasma. Customized CMOS chips have been successfully developed for the transmitter module and receiver module array, covering the 55–75 GHz working band. The transmitter module has the capability of simultaneously launching eight tunable probe frequencies (>0 dBm output power each). The receiver enclosure … Show more

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Cited by 3 publications
(1 citation statement)
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“…The most promising solution for high-level integration microwave diagnostics is system-on-chip, which develops all microwave circuits on a 10 mm 2 semi-conductor chip (CMOS, InP, GaAs, and GaN). This technology has been successfully developed on DIII-D since 2019 [48]. However, the reflectometers on a chip on DIII-D were applied to imaging reflectometry where fixed frequency or very limited frequency sweep is used.…”
Section: Development Of a Compact Reflectometermentioning
confidence: 99%
“…The most promising solution for high-level integration microwave diagnostics is system-on-chip, which develops all microwave circuits on a 10 mm 2 semi-conductor chip (CMOS, InP, GaAs, and GaN). This technology has been successfully developed on DIII-D since 2019 [48]. However, the reflectometers on a chip on DIII-D were applied to imaging reflectometry where fixed frequency or very limited frequency sweep is used.…”
Section: Development Of a Compact Reflectometermentioning
confidence: 99%