2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2020
DOI: 10.1109/itherm45881.2020.9190491
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System-Level Thermal Modeling and Its Significance in Electronics Packaging

Sevket U. Yuruker
1
,
Raphael Mandel
2
,
Patrick McCluskey
3
et al.
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Cited by 3 publications
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References 13 publications
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Electro-Thermal Co-Design of a Cooling System-Integrated High-Frequency Transformer

Park
1
,
Yuruker
2
,
Chakraborty
3
et al. 2020
2020 IEEE Transportation Electrification Conference &Amp; Expo (ITEC)
7
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4
0
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Electro-Thermal Co-Design of a Cooling System-Integrated High-Frequency Transformer

Park
1
,
Yuruker
2
,
Chakraborty
3
et al. 2020
2020 IEEE Transportation Electrification Conference &Amp; Expo (ITEC)
7
0
4
0
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Data Center Energy Reduction by Lowering Chip-to-Supply Thermal Resistance

Bock
1
,
Bress
2
,
Lecoustre
3
et al. 2023
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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A Vertically Enhanced Manifold Microchannel System for Thermal Management of Power Electronics

Yuruker
1
,
Mandel
2
,
McCluskey
3
et al. 2021
IEEE Trans. Compon., Packag. Manufact. Technol.
6
2
5
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