A Vertically Enhanced Manifold Microchannel System for Thermal Management of Power Electronics

Yuruker, Sevket U.; Mandel, Raphael; McCluskey, Patrick; Ohadi, Michael M.

doi:10.1109/tcpmt.2021.3082771

Cited by 6 publications

(7 citation statements)

References 33 publications

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“…6. A good agreement was obtained between previously conducted CFD predictions by Yuruker et al [18] and the experimental findings of this work, where maximum deviation was less than 13% and mean deviation was 5%, which fall within the experimental uncertainty, validating the CFD predictions of our previous work [18].…”

Section: Fabrication and Experimentssupporting

confidence: 92%

“…5 Experimental test section for thermo-fluidic characterization of VEMMS cooler Fig. 6 Pressure drop test results and comparison with CFD results [18] Fig. 7 Simplified thermal resistance network.…”

Section: Fabrication and Experimentsmentioning

confidence: 99%

“…As was discussed in Yuruker et al [18], the primary advantage of the air-cooled version of VEMMS is its reduced pressure drop versus flow rate characteristics, as a means to increase the flow rate from the fan. However, even though the selected fan is capable of providing 800 Pa static pressure, the pressure drop through the rotameter at the required flow rates would be too high, preventing us from mimicking realistic, real-life operational conditions and reducing the achievable flow rates.…”

Section: Fabrication and Experimentsmentioning

confidence: 99%

“…The novel vertically enhanced manifold microchannel system (VEMMS) design proposed in this study aims to find the sweet spot between these competing objectives. The detailed design and exhaustive computational fluid dynamics (CFD) analysis of the cooler was given by Yuruker et al [18], who included two distinct designs, tailored for high and medium heat fluxes, liquid and air-cooled versions, respectively. The primary purpose of one VEMMS cooler is to provide adequate thermal management for a pair of switches on a PCB while also functioning as electrical connections to and between them.…”

Section: Introductionmentioning

confidence: 99%

“…Although this work investigates performance in a single-sided-cooling configuration, the VEMMS approach can be utilized for double-sided cooling where the switches are sandwiched between two coolers and thermal resistance is nearly halved. For more details on the inception of the vertically enhanced manifold microchannel concept and extensive CFD analysis, readers are referred to another study by Yuruker et al [18].…”

Section: Introductionmentioning

confidence: 99%

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Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)

Yuruker

Mandel

McCluskey

et al. 2021

Journal of Heat Transfer

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Optimum thermal management of power electronics is necessary for their improved reliability and efficiency. Next generation electronics systems are predicted to dissipate more heat as die size shrinks and power levels increase. Traditional air-cooling approaches usually provide insufficient performance or require heavy and bulky heatsinks to achieve adequate thermal management. To tackle this, a novel air-cooled vertically enhanced manifold microchannel system (VEMMS) was developed. While minimizing the footprint requirement on the printed circuit board, it offers an efficient thermal management in a conformal scheme that accommodates the associated power electronics and their electrical connections. The present work describes manufacturing of the air-cooled VEMMS heatsink, and its experimental characterization and thermo-fluidic performance. Good agreement was obtained between the test results and numerical predictions. Using air at ambient conditions, a thermal resistance of 2.6 K/W was achieved, at 1.5cm2 footprint and 2cm3 total heatsink volume in a single-sided cooling architecture, enabling a full-bridge electrical power density of ~84 kWe/L and overall DC-DC converter's power density of ~20kWe/L, at reasonable flow rates and pressure drops using commercially available miniature electric fans. Index Terms-Air cooling, heatsink, manifold microchannel cooling, power electronics, power density, thermal management

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Section: Fabrication and Experimentssupporting

confidence: 92%

Section: Fabrication and Experimentsmentioning

confidence: 99%

Section: Fabrication and Experimentsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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