2021
DOI: 10.1016/j.matchemphys.2021.124470
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Synthesizing robust cuprous oxide film with adjustable morphologies as surface-enhanced Raman scattering substrate by copper anodization

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Cited by 4 publications
(5 citation statements)
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“…5 shows that the major diffraction peaks observed at 2 θ = 43.4°, 50.4° and 74.1° are assigned to the (111), (200) and (220) planes of the Cu substrate respectively. 12,22 Other smaller peaks can be observed at 2 θ = 36.5°, 38° and 61.5°.…”
Section: Resultsmentioning
confidence: 90%
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“…5 shows that the major diffraction peaks observed at 2 θ = 43.4°, 50.4° and 74.1° are assigned to the (111), (200) and (220) planes of the Cu substrate respectively. 12,22 Other smaller peaks can be observed at 2 θ = 36.5°, 38° and 61.5°.…”
Section: Resultsmentioning
confidence: 90%
“…The first and last peaks correspond to the diffraction from the (111) and (220) planes of Cu 2 O, respectively, 1,12,23 while the second one belongs to the (200) plane of CuO. 22,24 Fig.…”
Section: Resultsmentioning
confidence: 99%
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“…When the Cu foam was anodized at 30 mA cm -2 in a 3 mol L -1 aqueous KOH solution at 40 °C, leaf-like CuO/Cu 2 O nanosheets were obtained directly [105] . Recently, Anantharaj and coworkers found that a much denser Cu(OH) 2 /CuO nanoneedle array could be obtained within just 80 s by the anodization of Cu foil using a conventional three-electrode system-based potentiostatic (at 0.864 V vs. a RHE) method in 1.0 M KOH [106,107] . Increasing the pH of KOH electrolytes led to an increase in the average length of the Cu(OH) 2 /CuO nanoneedles.…”
Section: Nanoneedles Nanowires and Nanotubesmentioning
confidence: 99%
“…Copper anodization is an effective method to synthesize CuO and Cu 2 O film in situ on the copper substrates, which is a common conductor metal used on chips. [13,14] And another advantage of anodization is that the morphology of the film can be regulated easily by changing reaction parameters, such as oxidation potential, concentration and composition of electrolyte solution, temperature, reaction time, etc.…”
Section: Introductionmentioning
confidence: 99%