2019
DOI: 10.1039/c9ra02987g
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Synthesis of Sn/Ag–Sn nanoparticles via room temperature galvanic reaction and diffusion

Abstract: Coating of Ag–Sn intermetallic compound on Sn nanoparticles at room temperature.

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Cited by 7 publications
(5 citation statements)
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References 36 publications
(50 reference statements)
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“…12 Besides that, the galvanic displacement method has been used to synthesize the Ag-Sn intermetallic core with a SnO 2 shell, 14,26 and the Ag 3 Sn/Ag 4 Sn intermetallic shell with the core of Sn nanoparticles. 27 Most of the reports either show the appearance of the β-Sn phase along with the Ag-Sn intermetallic phase and/ or a broad range of size distributions. Reports on the synthesis of phase pure Ag-Sn intermetallics with a tight control over the size and well-defined shape are limited.…”
Section: Introductionmentioning
confidence: 99%
“…12 Besides that, the galvanic displacement method has been used to synthesize the Ag-Sn intermetallic core with a SnO 2 shell, 14,26 and the Ag 3 Sn/Ag 4 Sn intermetallic shell with the core of Sn nanoparticles. 27 Most of the reports either show the appearance of the β-Sn phase along with the Ag-Sn intermetallic phase and/ or a broad range of size distributions. Reports on the synthesis of phase pure Ag-Sn intermetallics with a tight control over the size and well-defined shape are limited.…”
Section: Introductionmentioning
confidence: 99%
“…48 The HR-TEM image, Figure 2h, also shows interlayer spacing values of 0.29 and 0.27 nm corresponding to (200) and (101) planes of the Sn lattice structure. 49,50 The crystallographic orientation of these planes is shown in Figure S3a. To obtain more information on the elemental composition of the expelled product, XPS and depth profiling analyses, Figure 2i, were performed.…”
Section: Expulsion From Galinstan In Aqueous and Non-aqueous Electrol...mentioning
confidence: 99%
“…Metal nanoparticles are promising for manufacturing high-performance printable electronics for various applications. Currently, metallic silver is the most widely used material, but cost-effective alternatives urgently need to be developed due to its relatively expensive cost. Tin (Sn) metal is a promising alternative to metallic silver due to its low cost, low melting point, and good chemical stability in bulk. However, the route to obtain Sn nanoparticles and the electronic device based on them is still limited by the high intrinsic reactivity. These nanoparticles are susceptible to re-oxidation in air, either after synthesis, during purification, or when the material is stored. Therefore, developing tin nanoparticles with high antioxidation properties and excellent dispersibility is necessary to realize their potential fully.…”
Section: Introductionmentioning
confidence: 99%