Synthesis of patterned freestanding nickel nanowires by using ion track-etched polyimide

Walewyns, Thomas; Scheen, Gilles; Tooten, Ester; Francis, Laurent

doi:10.1117/12.886775

“…In this process route, the fabrication is based on the microstructuration of nanoporous ion track-etched PI in order to synthesize nanowires by electrodeposition [19], as depicted in figure 9. Common applications involve the synthesis of transition-metals nanowires.…”

Section: Polyimide For Electrodeposited Nanowires Integration In a Mementioning

confidence: 99%

“…PI can also act as a thermal insulating layer to prevent heat leakage to the substrate in nano-and microsystems thanks to a thermal conductivity of about 0.3 W m −1 K −1 [18]. Furthermore, nanoporous PI membranes produced by ion track-etching have been successfully used for the synthesis of patterned freestanding nanowires by electrodeposition [19,20], using techniques previously developed for polycarbonate (PC) [21][22][23] or anodized aluminum oxide (AAO) templates [24,25]. This paper describes a microfabrication process involving the structuring of PI as the sacrificial layer for surface micromachining and as a template for the integration of metallic nanowires into microsystems.…”

Section: Introductionmentioning

confidence: 99%

Poling Field Dependence of Longitudinal and Transverse Wave Velocities, Young's Modulus, and Poisson's Ratio in Piezoelectric Ceramics

Ogawa¹,

Ishii²,

Matsumoto³

et al. 2012

Jpn. J. Appl. Phys.

View full text Add to dashboard Cite

The interest of using polyimide as a sacrificial and anchoring layer is demonstrated for post-processing surface micromachining and for the incorporation of metallic nanowires into microsystems. In addition to properties like a high planarization factor, a good resistance to most non-oxidizing acids and bases, and CMOS compatibility, polyimide can also be used as a mold for nanostructures after ion track-etching. Moreover, specific polyimide grades, such as PI-2611 from HD Microsystems TM , involve a thermal expansion coefficient similar to silicon and low internal stress. The process developed in this study permits higher gaps compared to the state-of-the-art, limits stiction problems with the substrate and is adapted to various top-layer materials. Most metals, semiconductors or ceramics will not be affected by the oxygen plasma required for polyimide etching. Released structures with vertical gaps from one to several tens of μm have been obtained, possibly using multiple layers of polyimide. Furthermore, patterned freestanding nanowires have been synthesized with diameters from 20 to 60 nm and up to 3 μm in length. These results have been applied to the fabrication of two specific devices: a generic nanomechanical testing lab-on-chip platform and a miniaturized ionization sensor.(Some figures may appear in colour only in the online journal) Polyimide (PI) is often selected for its high planarization factor, CMOS compatibility, tolerance to most chemical products used in microfabrication, and chemical resistance up to high temperatures. Moreover, depending on its formulation, PI can be spin-coated with thicknesses as high as several tens of μm and as low as 200 nm by diluting the precursor solution in its solvant [8]. A large range of possible gaps is thus allowed between a top movable clamped-clamped membrane or beam and a fixed bottom electrode lying on the substrate. New formulations of PI show additional interesting properties such as a thermal expansion coefficient similar to silicon (Si),

show abstract

Polyimide as a versatile enabling material for microsystems fabrication: surface micromachining and electrodeposited nanowires integration

Walewyns

¹

,

Reckinger

²

,

Ryelandt

³

et al. 2013

J. Micromech. Microeng.

View full text Add to dashboard Cite

The interest of using polyimide as a sacrificial and anchoring layer is demonstrated for post-processing surface micromachining and for the incorporation of metallic nanowires into microsystems. In addition to properties like a high planarization factor, a good resistance to most non-oxidizing acids and bases, and CMOS compatibility, polyimide can also be used as a mold for nanostructures after ion track-etching. Moreover, specific polyimide grades, such as PI-2611 from HD Microsystems™, involve a thermal expansion coefficient similar to silicon and low internal stress. The process developed in this study permits higher gaps compared to the state-of-the-art, limits stiction problems with the substrate and is adapted to various top-layer materials. Most metals, semiconductors or ceramics will not be affected by the oxygen plasma required for polyimide etching. Released structures with vertical gaps from one to several tens of μm have been obtained, possibly using multiple layers of polyimide. Furthermore, patterned freestanding nanowires have been synthesized with diameters from 20 to 60 nm and up to 3 μm in length. These results have been applied to the fabrication of two specific devices: a generic nanomechanical testing lab-on-chip platform and a miniaturized ionization sensor.

show abstract

A novel MEMS tunable ionization sensor based on patterned freestanding Nickel nanowires and moving electrode

Walewyns

¹

,

Francis

²

2011

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

View full text Add to dashboard Cite

Synthesis of patterned freestanding nickel nanowires by using ion track-etched polyimide

Cited by 3 publications

References 0 publications

Poling Field Dependence of Longitudinal and Transverse Wave Velocities, Young's Modulus, and Poisson's Ratio in Piezoelectric Ceramics

Poling Field Dependence of Longitudinal and Transverse Wave Velocities, Young's Modulus, and Poisson's Ratio in Piezoelectric Ceramics

Polyimide as a versatile enabling material for microsystems fabrication: surface micromachining and electrodeposited nanowires integration

A novel MEMS tunable ionization sensor based on patterned freestanding Nickel nanowires and moving electrode

Contact Info

Product

Resources

About