Synthesis of nano-copper particles for conductive ink in gravure printing

Fan, Xiaoliang; Mo, Lixin; Li, Wenbo; Li, Weiwei; Ran, Jun; Jilan, Fu; Zhao, Xizhe; Li, Luhai

doi:10.1109/nems.2013.6559843

Cited by 5 publications

(4 citation statements)

References 14 publications

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“…In Fan’s work [26], copper nanoparticles were dispersed in solutions by a high shear dispersing emulsifier to fabricate stable gravure conductive ink. Joo et al [13] also conducted a combined pretreatment of simultaneous mechanical stirring and ultrasonic processing followed by a ball milling process when dispersing micro- and nano-copper particles in a mixed solvent of diethylene glycol and PVP to prepare the conductive ink.…”

Section: Resultsmentioning

confidence: 99%

Structure Inheritance in Nanoparticle Ink Direct-Writing Processes and Crack-Free Nano-Copper Interconnects Printed by a Single-Run Approach

Liu

Xing

et al. 2019

Materials

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When nanoparticle conductive ink is used for printing interconnects, cracks and pores are common defects that deteriorate the electrical conductivity of the printed circuits. Influences of the ink solvent, the solid fraction of the ink, the pre-printing treatment and the sintering parameters on the interconnect morphology and conductivity were investigated. It was found that the impacts of all these factors coupled with each other throughout the whole procedure, from the pre-printing to the post-printing processes, and led to a structure inheritance effect. An optimum process route was developed for producing crack-free interconnects by a single-run direct-writing approach using home-made nano-copper ink. A weak gel was promoted in the ink before printing in the presence of long-chain polymers and bridging molecules by mechanical agitation. The fully developed gel network prevented the phase separation during ink extrusion and crack formations during drying. With the reducing agents in the ink and slow evaporation of the ink solvent, compact packing and neck joining of copper nanoparticles were obtained after a two-step sintering process. The crack-free interconnects successfully produced have a surface roughness smaller than 1.5 μm and the square resistances as low as 0.01 Ω/□.

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Section: Resultsmentioning

confidence: 99%

Structure Inheritance in Nanoparticle Ink Direct-Writing Processes and Crack-Free Nano-Copper Interconnects Printed by a Single-Run Approach

Liu

Xing

et al. 2019

Materials

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“…Tang et al printed high stability copper colloids dissolved in the diethylene glycol solution by an inkjet method. Besides, many research teams have prepared copper conductive ink by dispersing nanostructured copper into mixed solvents, such as (terpineol, ethanol, and lactic acid), (ethanol, glycerol, and isobutanol), 2-(2-butoxythoxy)-ethanol, α-terpineol, (diethylene glycol and isopropyl alcohol with a 6:2:2% volume ratio), (isopropanol and propylene glycol methyl ether), (hydroxyl terminated polybutadiene and toluene diisocyanate), (ethylene glycol and glycerin additives), and (PVP and diethylene glycol) …”

Section: Development Of Copper Conductive Ink Materialsmentioning

confidence: 99%

Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid Electronics

Chang

Khuje

et al. 2021

ACS Nano

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Printed copper materials have been attracting significant attention prominently due to their electric, mechanical, and thermal properties. The emerging copper-based flexible electronics and energy-critical applications rely on the control of electric conductivity, current-carrying capacity, and reliability of copper nanostructures and their printable ink materials. In this review, we describe the growth of copper nanostructures as the building blocks for printable ink materials on which a variety of conductive features can be additively manufactured to achieve high electric conductivity and stability. Accordingly, the copper-based flexible hybrid electronics and energy-critical devices printed by different printing techniques are reviewed for emerging applications.

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“…Much research has been done on printable metal conductor including copper, silver, and gold on flexible substrates [15][16][17][18][19][20][21][22][23][24][25][26]. Direct deposition of molten metals is beyond the thermal window of printing on flexible substrates; therefore, most of the research work on printable conductor ink has focused on the mix of organic solvent with metallic particle solute.…”

Section: List Of Figuresmentioning

confidence: 99%

Mechanical and High-Frequency Electrical Study of Printed, Flexible Antenna Under Deformation

Zhou

Sivapurapu

Swaminathan

et al. 2020

IEEE Trans. Compon., Packag. Manufact. Technol.

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The meaningful discussions we shared on research work and life have indeed made my experience in graduate school more than enjoyable. In addition, I would like to thank other professionals and students who are involved in my research including Dr. Jim Huang from Hewlett Packard Enterprise as well as Sridhar Sivapurapu and Nahid Aslani Amoli from Dr. Swaminathan's group. Many thanks are due to my parents who always stood behind every critical decision I made. I would not have accomplished this milestone without their love, support, and trust. I would like to acknowledge that this material is based, in part, on research sponsored by Air Force Research Laboratory under agreement number FA8650-15-2-5401, as conducted through the flexible hybrid electronics manufacturing innovation institute, NextFlex. ivTABLE OF CONTENTS ACKNOWLEDGEMENTS iii LIST OF TABLES vi LIST OF FIGURES vii LIST OF SYMBOLS AND ABBREVIATIONS xiv SUMMARY xvi CHAPTER 1. INTRODUCTION CHAPTER 2. BACKGROUND AND LINTERATURE REVIEW 2.1 History of Conformal Antenna and Flexible Printed Antenna 2.2 Mechanical Testing of Flexible Printed Electronics 2.3 Antenna Performance Under Strain CHAPTER 3. OBJECTIVES AND SCOPE CHAPTER 4. ANTENNA DESIGN AND FABRICATION RESULTS 4.1 Fabrication Process 4.2 Antenna Design in HFSS 4.2.1 Layer Thickness 4.2.2 Material Electrical Properties 4.2.3 HFSS Simulation Setup and Results 4.3 Fabrication Results and Comparison to Simulation CHAPTER 5. MANDREL BENDING TEST AND RESULTS 5.1 Mandrel Bending Test Over Different Sizes of Mandrel 5.1.1 Experimental Setup and Procedure 5.1.2 Experimental Test Results 5.2 Cyclic Mandrel Bending Test over Mandrel Size of 0.625 in. Radius 5.2.1 Experimental Procedure and Results of Sample P1 5.2.2 Experimental Procedure and Results of Sample P2 CHAPTER 6. MECHANICAL FINITE-ELEMENT ANALYSIS OF MANDREL BENDING TEST 6.1 Geometry Modeling 6.2 Material Modeling 6.2.1 Characterization of Printed Silver Ink's Property 6.2.2 Other Materials' Properties 6.3 Loading and Boundary Conditions v 6.4 Initial Meshing Details 6.5 Mesh Convergence and Simulation Results CHAPTER 7. BIAXIAL BENDING TEST AND RESULTS 7.1 Experimental Fixture Design and Setup 7.2 Experimental High-Frequency Measurement Results 7.3 SEM Images Results CHAPTER 8. MECHANICAL FINITE-ELEMENT ANALYSIS OF THE BIAXIAL BENDING TEST 8.1 Loading and Boundary Conditions 8.2 Mesh Convergence and Simulation Results CHAPTER 9. Conductivity Change Impact on Patch Antenna's High-Frequency Electrical Behavior 9.1 Updated HFSS Model 9.2 Conductivity Impact on the S11 Response CHAPTER 10. Conclusion, Contributions, and Future Work 10.1 Conclusion 10.2 Contributions 10.3 Future Work REFERENCES CHAPTER 1.

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Synthesis of nano-copper particles for conductive ink in gravure printing

Cited by 5 publications

References 14 publications

Structure Inheritance in Nanoparticle Ink Direct-Writing Processes and Crack-Free Nano-Copper Interconnects Printed by a Single-Run Approach

Structure Inheritance in Nanoparticle Ink Direct-Writing Processes and Crack-Free Nano-Copper Interconnects Printed by a Single-Run Approach

Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid Electronics

Mechanical and High-Frequency Electrical Study of Printed, Flexible Antenna Under Deformation

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