Synthesis, characterization and dielectric properties of surface functionalized ferroelectric ceramic/epoxy resin composites with high dielectric permittivity

Luo, Bing; Wang, Xiaohui; Zhao, Qiancheng; Li, Longtu

doi:10.1016/j.compscitech.2015.02.018

Cited by 84 publications

(22 citation statements)

References 32 publications

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“…Among various thermoset and thermoplastic polymers, thermoset epoxy resin possesses high mechanical properties, excellent thermal and dimensional stability. However, as epoxy polymers undergo the state of solidification, it becomes more brittle in nature [3,4]. High brittleness is a matter of serious problem which can be minimized by incorporating natural or inorganic fiber/filler.…”

Section: Introductionmentioning

confidence: 99%

Thermomechanical behavior of graphene nanoplatelets and bamboo micro filler incorporated epoxy hybrid composites

Gouda¹,

Bhowmik²,

Das³

2020

Mater. Res. Express

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The present study is focused on the development of micro bamboo filler/epoxy hybrid composite with the incorporation of varied weight percentage of graphene nanoplatelet (GNPs). To check the effect of inclusion of dual fillers on the structural x-ray diffraction (XRD), morphological analysis by Scanning electron microscope (SEM) and thermomechanical analysis (TMA) are carried out. The micro bamboo and GNPs filler in the epoxy polymer are incorporated to eradicate the problem associated with natural and synthetic fibers alignment, delamination, and anisotropic property in the thermoset composite materials. Results revealed that with the inclusion of graphene nanoplatelet with bamboo filler in epoxy composite improves the synergetic effect, which in turn increases the tensile, flexural, loss modulus and storage modulus of developed hybrid composite material. SEM analysis confirmed the proper distribution of fillers and their presence from XRD analysis. All fabricated hybrid composite displayed improved thermal conductivity value and a marginal increase in the corrosion rate. The overall result predicts that the improvement is quite better compared to neat or solo bamboo filler based epoxy composite. The improvement is ascribed due to the proper interfacial bonding or cross-link between micro bamboo filler/epoxy polymer with the addition of GNPs. Developed filler based hybrid composite may be utilized for the application of thermal interface material, circuit board, electronic packaging, etc.

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Section: Introductionmentioning

confidence: 99%

Thermomechanical behavior of graphene nanoplatelets and bamboo micro filler incorporated epoxy hybrid composites

Gouda¹,

Bhowmik²,

Das³

2020

Mater. Res. Express

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show abstract

“…However, several intrinsic defects, including brittleness, weak dielectric strength, difficult to process and/or extremely high processing temperature, have encountered when using these inorganic ceramics1718. In recently years, high performance polymers and polymer based composites as ideal alternative candidates for these applications have been intensively investigated owing to their fascinating properties1920212223242526.…”

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confidence: 99%

Crosslinked polyarylene ether nitrile film as flexible dielectric materials with ultrahigh thermal stability

Yang

Wei

et al. 2016

Sci Rep

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Dielectric film with ultrahigh thermal stability based on crosslinked polyarylene ether nitrile is prepared and characterized. The film is obtained by solution-casting of polyarylene ether nitrile terminated phthalonitrile (PEN-Ph) combined with post self-crosslinking at high temperature. The film shows a 5% decomposition temperature over 520 °C and a glass transition temperature (Tg) around 386 °C. Stable dielectric constant and low dielectric loss are observed for this film in the frequency range of 100–200 kHz and in the temperature range of 25–300 °C. The temperature coefficient of dielectric constant is less than 0.001 °C−1 even at 400 °C. By cycling heating and cooling up to ten times or heating at 300 °C for 12 h, the film shows good reversibility and robustness of the dielectric properties. This crosslinked PEN film will be a potential candidate as high performance film capacitor electronic devices materials used at high temperature.

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“…As we know, the dielectric properties of a composite will undergo signicant changes near its percolation threshold, [8][9][10][11] and numerous researches have conrmed that percolative composites are promising candidates for high-k materials with outstanding dielectric properties, such as tunable high permittivity, high dielectric strength, low loss, etc. Therefore, various strategies have been developed to obtain high-k according to percolation theory in composite materials, such as ferroelectric/polymer composites, [12][13][14] binary or ternary metal (or carbon)/polymer composites, [15][16][17] metal (or carbon)/ ceramic composites, etc. [18][19][20][21] In these composites, a certain volume fraction (lower than but still near the percolation threshold) of metal, carbon or ferroelectric powders should be dispersed into the matrix to achieve excellent dielectric performance.…”

Section: Introductionmentioning

confidence: 99%

Ni/Al₂O₃/epoxy high-k composites with ultralow nickel content towards high-performance dielectric applications

et al. 2016

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Nickel/alumina/epoxy three-phase composites consisting of nickel particles dispersed in alumina/epoxy composite matrix were prepared using a facile wet impregnation process. The influences of in situ formed alumina particles (i-Al 2 O 3 ) and epoxy on the dielectric properties of the composites were investigated in detail. For the composites with nickel contents far below the percolation threshold, the main electrical conduction mechanism is hopping conduction, and the main loss comes from polarizations. Therefore, the formation of alumina and epoxy result in higher permittivity but high loss due to the enhanced interfacial polarization. For the composites with nickel contents below but near the percolation threshold, the main electrical conduction mechanism is metal-like conduction and the main loss comes from eddy currents under high frequency electric field. Accordingly, the i-Al 2 O 3 and filled epoxy between nickel particles could bring both high permittivity and low loss. This paper experimentally shows how the characteristics of the interface between different phases influence the dielectric performances of composites. And the impregnation process is an effective strategy to obtain percolative metal/ceramic/polymer three-phase composites with ultralow metal content, high permittivity and low loss.

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Synthesis, characterization and dielectric properties of surface functionalized ferroelectric ceramic/epoxy resin composites with high dielectric permittivity

Cited by 84 publications

References 32 publications

Thermomechanical behavior of graphene nanoplatelets and bamboo micro filler incorporated epoxy hybrid composites

Thermomechanical behavior of graphene nanoplatelets and bamboo micro filler incorporated epoxy hybrid composites

Crosslinked polyarylene ether nitrile film as flexible dielectric materials with ultrahigh thermal stability

Ni/Al₂O₃/epoxy high-k composites with ultralow nickel content towards high-performance dielectric applications

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Synthesis, characterization and dielectric properties of surface functionalized ferroelectric ceramic/epoxy resin composites with high dielectric permittivity

Cited by 84 publications

References 32 publications

Thermomechanical behavior of graphene nanoplatelets and bamboo micro filler incorporated epoxy hybrid composites

Thermomechanical behavior of graphene nanoplatelets and bamboo micro filler incorporated epoxy hybrid composites

Crosslinked polyarylene ether nitrile film as flexible dielectric materials with ultrahigh thermal stability

Ni/Al2O3/epoxy high-k composites with ultralow nickel content towards high-performance dielectric applications

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Product

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Ni/Al₂O₃/epoxy high-k composites with ultralow nickel content towards high-performance dielectric applications