2016
DOI: 10.1038/srep36434
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Crosslinked polyarylene ether nitrile film as flexible dielectric materials with ultrahigh thermal stability

Abstract: Dielectric film with ultrahigh thermal stability based on crosslinked polyarylene ether nitrile is prepared and characterized. The film is obtained by solution-casting of polyarylene ether nitrile terminated phthalonitrile (PEN-Ph) combined with post self-crosslinking at high temperature. The film shows a 5% decomposition temperature over 520 °C and a glass transition temperature (Tg) around 386 °C. Stable dielectric constant and low dielectric loss are observed for this film in the frequency range of 100–200 … Show more

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Cited by 54 publications
(46 citation statements)
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“…The phthalonitrile end‐capping PEN (PEN‐Ph) which possesses crosslinkable property has attracted considerable attention due to its superior thermal and mechanical properties . In this PEN‐Ph system, the phthalonitrile group on the ends of the PEN molecular chain could react with each other to form the structural stable phthalocyanine ring, making the system from linear structure transform to three‐dimensional (3D)network structure .…”
Section: Introductionmentioning
confidence: 99%
“…The phthalonitrile end‐capping PEN (PEN‐Ph) which possesses crosslinkable property has attracted considerable attention due to its superior thermal and mechanical properties . In this PEN‐Ph system, the phthalonitrile group on the ends of the PEN molecular chain could react with each other to form the structural stable phthalocyanine ring, making the system from linear structure transform to three‐dimensional (3D)network structure .…”
Section: Introductionmentioning
confidence: 99%
“…The present solution, which uses additional thermal management systems to cool the devices, is impracticable in low-cost and large-scale applications. As a result, candidates with higher T g are imperative [35]. Polyarylene ether nitrile (PEN), a high-performance thermoplastic polymer, has been intensively studied because of its excellent performances including thermal stability, easy processing, radiation resistance, and excellent mechanical performances as well as chemical resistance [36][37][38].…”
Section: Introductionmentioning
confidence: 99%
“…Although the inorganic dielectric materials usually show higher dielectric constant which is critical for its application, its fragility and high processing temperature limit its further application. With the development of information technology and microelectronics industry, the miniaturization, integration, and intellectualization of new devices such as dielectric substrate, dielectric antenna, and embedded thin film capacitor require that the dielectric materials not only show excellent dielectric properties but also have good mechanical properties and processing properties [11,12].…”
Section: Introductionmentioning
confidence: 99%
“…In comparing with the inorganic dielectric materials, the dielectric materials especially the polymeric dielectric materials exhibit the advantages of low intrinsic density, excellent performance, easy processing, long serving life, and even recyclability [11]. However, pure polymer material suffers from the defect of low dielectric constant [21,22].…”
Section: Introductionmentioning
confidence: 99%