Synthesis and thermal cure of diphenyl ethers terminated with acetylene and phenylacetylene

Abstract

Two kinds of novel compounds, diphenylacetylene diphenyl ether (DPADPE) and diacetylene diphenyl ether (DADPE), were prepared and polymerized under heating. Raman, DSC and 13 C CP/MAS NMR analyses were used for studying the polymerization reaction. DPADPE and DADPE have melting points at 190 and 79 • C, with exothermic peaks of the DSC curves at 375 and 215 • C for curing, respectively. Raman and 13 C CP/MAS NMR spectra show that DPADPE could be cured at a temperature higher than 300 • C and DADPE at a lower temperature of higher than 150 • C. The kinetic parameters for the thermal crosslinking reactions were obtained by the Ozawa method and the results show that the apparent activation energy is 152 kJ mol −1 for DPADPE and 109 kJ mol −1 for DADPE. An ene-yne Straus product appears in the cured DADPE, whereas this product has not been identified in the cured DPADPE. The cured DPADPE and DADPE demonstrate good thermal and thermo-oxidative stability.

Synthesis and characterization of a novel polytriazole resin with low‐temperature curing character

“…The excessive alkyne group would remain unreacted because the alkyne group would react obviously with itself by the alkyne Straus coupling, etc. at temperatures higher than 2008C 25,26 Thereby, there are some free alkyne groups present in the formed crosslinking structure, which would result in an easy motion of chain segments. In addition, the alkyne unit (B 4 ) in the crosslinked polymer is more flexible than the azide unit (A 3 ) due to the -CH 2 -link between the benzene rings.…”

Synthesis and characterization of new disilane -containing arylacetylene resin

“…The crosslinking of outer ethynyl groups occurred at a lower temperature and that of the inner ethynyl groups occurred at a higher temperature [20]. Therefore, two exothermic peaks could be attributed to the cross-linking reaction of the outer and inner ethynyl groups of the resin respectively.…”

Effect of side groups on the properties of silicon‐containing arylacetylene resins

“…[1] Our laboratory has been devoted to the synthesis and modification of silicon-containing arylacetylene resins since 2002. [1,[5][6][7][8][9][10][11][12][13][14][15][16] Thereafter, a variety of silicon-containing arylacetylene resins have been developed by introducing various silane units with different groups, multidimethylsiloxane units, a carborane unit, and aryl ether structures into the main chains of the resins to improve the processability, [17] mechanical properties, [18,19] heat resistance [20] or thermal oxidation stability. [21] As well known, the properties of polymers depend largely on their structures.…”