Synthesis and characterization of a novel polytriazole resin with low‐temperature curing character

Abstract

A novel low-temperature curing polytriazole resin was prepared from a triazide and a tetraalkyne and characterized. The resin can be cured at 70-C. The glass transition temperature T g and thermal decomposition temperature T d5 of the cured resin with the molar ratio of azide to alkyne group [A]/ [B] ¼ 1.0:1.0 reached 324 and 355-C, respectively. The study on the curing kinetics of the resin shows that the apparent activation energy of the curing reaction is 93 kJ mol S1 . The flexural strength of the cured resin reached 137.6 MPa at room temperature and 102.6 MPa at 185-C.Low temperature curing polytriazole resin 557 1608C/2hr, 1808C/2hr, and 2008C/2hr, the DSC curve of the cured A 3 B 4 resin is shown in Fig. 4. As shown in Fig. 4, there was no thermal effect in the whole scanning. This indicates that the curing reaction of A 3 B 4 resin has been completed. Thermal properties of the cured A 3 B 4 resinDMA of the cured A 3 B 4 resin was performed under nitrogen atmosphere. The result is shown in Fig. 5. The glass transition temperature of the cured A 3 B 4 resin reaches 3248C. Thermo-gravimetric curves of the cured A 3 B 4 resin under Scheme 1. Schematic polymerization of A 3 and B 4 .

Preparation and properties of bismaleimide resins modified with hydrogen silsesquioxane and dipropargyl ether and their composites

“…[19][20][21][22][23][24] A new kind of thermosetting resin with terminal propargyl groups has recently been developed as a high-performance polymer owing to its good processability, advantageous dielectric and mechanical properties and excellent thermal stability, whether in air or in a nitrogen atmosphere. [25][26][27][28][29][30] This paper presents new modified BMI resins prepared from BMI, HSQ and dipropargyl aryl ethers. We investigated the processability, mechanical properties and heat resistance of the resins and their composites.…”

Synthesis and characterization of a novel silicon‐containing polytriazole resin

“…12,13 The silicon-containing arylacetylene polymers composed of [ASiR 2 ACBCAArACBCA] (R ¼ alkyl or phenyl) units exhibit excellent thermal stabilities after curing. [14][15][16][17] There is high content of the ethynylene group in the backbone of the polymers.…”

Metal‐Free Cycloaddition of Internal Alkynes and Multifunctional Azides Under Solvent‐Free Conditions

“…[12][13][14][15][16][17][18][19][20][21][22][23][24][25][26] The classical (thermal) 1,3-dipolar cycloaddition can be performed between azides and terminal alkynes as well as internal triple bonds. Generally, the reactivity of alkynes for the click reaction is rather low due to its high electron density at the alkyne functionality.…”