Synthesis and properties of polyimides derived from cis- and trans-1,2,3,4-cyclohexanetetracarboxylic dianhydrides

Low dielectric behavior of amine functionalized MCM-41 reinforced polyimide nanocomposites

“…Comparatively among all engineering polymers, PIs have been widely used as dielectric and packaging materials in the microelectronics industry because of their several merits such as good mechanical, thermal, and dielectric properties. [4][5][6][7][8] The increasing demand for low-k dielectric PI materials in the integrated circuitry device fabrications and aerospace industries in the form of films and moldings [9][10][11] led to extensive efforts to explore the applicability of porous materials, with specific focus on nanoporous materials. [12][13][14][15] In addition, the incorporation of porous inorganic materials like, ceramics, polyhedral oligomeric silsesquioxanes, SiO 2 , mobil composition of matter no.…”

Ageing of PCCD aliphatic polyesters: Effect of stereochemistry and ionic chain terminals

“…Therefore, the thermal behaviour of PCCD is strongly influenced by the cis/trans isomeric ratio [18][19][20][21][22][23][24][25]. In particular, in a previous study, the authors demonstrated that the crystallinity is modulated by the molar percentage of trans cycloaliphatic units in PCCD samples prepared from CHDM (with 66 mol% of trans isomer) and DMCD (with trans isomer content variable from 24 to 97 mol%).…”

Controllable low dielectric porous polyimide films templated by silica microspheres: Microstructure, formation mechanism, and properties

“…As a high performance polymer material, polyimide (PI), which exhibits outstanding dielectric, mechanical properties, thermal stability, and low coefficients of thermal expansion, has become an indispensable material in many areas [4][5][6]. Particularly porous PI material, combining high performance of PI and lowest dielectric constant of air void (k % 1), is thought to be the most promising candidate for use as a next-generation of interlayer dielectrics [7].…”