Low‐k dielectrics have been developed as an interlayer insulating material in the large scale integrated circuitry devices by the copolymerization of various weight percentages (10, 20, 30, and 40 wt%) of cyanate ester tethered POSS (POSS‐OCN) and bisphenol‐A cyanate ester (BACY) to obtain BACY/POSS‐OCN nanocomposites. The reinforcement of POSS‐OCN significantly contributes to the reduction in the value of dielectric constant and dielectric loss as well, which might be due to the presence of porous structured POSS‐OCN. The 30 wt% POSS‐OCN/BACY nanocomposite possesses the lowest value of dielectric constant of 1.81 at 1 MHz. Copyright © 2016 John Wiley & Sons, Ltd.
Cyanate ester terminated polydimethylsiloxane (PDMS-OCN) was synthesized and is copolymerized with DGEBA (1 : 1 and 2 : 1 ratios) through the formation of oxazoline ring to obtain a thermally stable and flexible hybrid PDMS-DGEBA polymer matrix. Subsequently, the radiation resistant behavior of PDMS-DGEBA is studied by a UV treatment process. UV irradiated PDMS-DGEBA films possess an excellent radiation resistance due to the formation of a passive silica layer on the surface of the sample, which effectively protects the materials from UV rays. The silica layer formation was confirmed by scanning electron microscopy (SEM) images. Moreover, X-ray photoelectron spectroscopy (XPS) analysis of PDMS-DGEBA also supports the increasing percentage of silica content after the irradiation of UV rays. Furthermore, the lower values of dielectric constant and dielectric loss, higher thermal stability and excellent radiation resistant properties of PDMS-DGEBA confirm that it can be used as an effective interlayer for low k dielectrics as an insulating material in ultra large scale integrated circuitry (ULSIC) devices. Scheme 1 Hydrosilylation of PDMS with eugenol. Scheme 2 Synthesis of PDMS-OCN cyanate ester monomer. Scheme 3 Synthesis of PDMS-DGEBA polymer. 63642 | RSC Adv., 2015, 5, 63641-63649 This journal is
The shape memory polymer was developed by the copolymerization of varying weight percentages (30, 40 and 50 wt%) of 1, 3-bis (4-cyanatobenzyl) cyclohexane cyanate ester (BCC) and diglycidyl ether of bisphenol A through the formation of oxazoline and triazine ring without using any external flexibilizer/plasticizer. The copolymer samples were characterized by FTIR spectroscopy, TGA, UV-Vis and XPS analysis. Thermo-mechanical and rheological characterizations were carried out using dynamic mechanical analyzer (DMA). The changes of shape memory behavior and storage modulus were tuned by changing the concentration of oxazoline and triazine ring in the resulting copolymer using varying weight percentages of BCC.The shape fixity behavior increases with increase in weight percentages of BCC up to 50 wt% and beyond this weight percentage of BCC the brittleness behavior of the polymer was noticed.
A class of low dielectric constant polyimide (PI) composites was prepared by means of reduced polarization. Consequently, the nonpolar group of long aliphatic chain bridged diamine was synthesized and utilized to prepare PI with pyromellitic dianhydride and subsequently the porous amine-functionalized mobil composition of matter no. 41 (FMCM-41) was synthesized and reinforced into the PI matrix with a view to reduce the value of dielectric constant of PI. Various analytical techniques such as Fourier transform infrared, proton nuclear magnetic resonance, and carbon nuclear magnetic resonance were used to characterize and confirm the synthesized monomer and polymer. The porous nature of hybrid polymer nanocomposites was ascertained using transmission electron microscopic images, and the aggregations of nanoparticles were confirmed by scanning electron microscopic images. The mechanical (tensile) and dielectric behaviors of a material were ascertained by the measurement of porosity. The optimum concentration of FMCM-41-reinforced PI (7 wt% FMCM-41/PI) has the lowest value of dielectric constant of 2.21 at 1 MHz, and beyond this concentration (10 wt% FMCM-41/PI), the reverse trend was observed in the values of dielectric constant and dielectric loss, due to the agglomeration of silica nanoparticles in the PI matrix.
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