Synthesis and characterization of organic–inorganic hybrids based on epoxy resin and 3‐glycidyloxypropyltrimethoxysilane

Abstract

Organic-inorganic hybrid materials based on diglycidyl ether of bisphenol A (DGEBA) and 3-glycidyloxypropyltrimethoxysilane (GLYMO) were prepared, using a poly(oxypropylene) diamine Jeffamine D230 as a curing agent. Materials were studied by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), infrared spectroscopy, swelling in tetrahydrofurane (THF), and Soxhlet extraction in THF. A dependence of the final conversion of epoxy groups and the final degree of organic phase crosslinking on inorganic phase content was found.The inorganic phase presents a steric hindrance to full crosslinking of epoxy groups. It also immobilizes the organic chains and improves the temperature stability of hybrid materials. Products of GLYMO hydrolysis together with unreacted organic molecules lower the glass transition temperature of hybrid materials

Hybrid Nanocomposites Based on Epoxy/silsesquioxanes Matrices Reinforced with Multi-walled Carbon Nanotubes

“…On the other hand, the CNT presence in the epoxy/silsesquioxane matrixes did not favored the degradation of theses matrices, confirming the higher thermal stability provided by silsesquioxanes 5,9 .…”

“…Furthermore, a decrease in the T g value with the incorporation of a random 5,7,8,29 or organized polysilsesquioxane structures 2,30,31 in epoxy matrix have been reported in literature. On the other hand, in our previous work 13 , the incorporation of the APTES/PTES copolysilsesquioxane provided improvement on T g up to 13 °C in relation to neat LY matrix.…”

“…Silsesquioxanes are typical organic-inorganic materials and can be incorporated into almost any kind of thermoplastic or thermosetting polymer to improve their properties 4 . Epoxy/silsesquioxane hybrids present improvements in thermal stability 5 , dielectric properties 6 , corrosion resistance 7 , and mechanical properties 8 , as well as reduced flammability 9 , in comparison with neat epoxy resin. In this context, increases in glass transition temperature (T g ) with chemical modifications of epoxy matrixes by random 10 or organized 11 structures with polysilsesquioxanes are scarcely reported.…”

Preparation and characterization of epoxy–silica networks chemically bonded through aminophenyl-trimethoxysilane

“…Macan et al [20,21] have studied the influence of silica network produced from the sol-gel process on the cure kinetics of epoxies in THF using the different techniques. They observed that inorganic phase influence the cure kinetics thus hindering the cross-linking of organic phase.…”

“…The filler-matrix interface also plays an important role; if the T g of the interface is less than that of the matrix, the T g of the resulting composite may decrease, but if the T g of the interface is higher than that of the matrix, the T g of composite will increase by increasing filler content [29]. The silanes used previously [6,[19][20][21][22][23]27] to compatiblize the organic inorganic phases (e.g., 3-aminopropyl-triethoxysilane, N-(2-aminoethyl)-3-aminopropyl-trimethoxysilane, 3-glycidoxy propyl-trimethoxysilane) had the propyl chain as interface which is considered to be very flexible. We in the present paper have used instead aminophenyl-trimethoxysilane (APTMOS) where the phenyl group acting as inter-phase is more rigid than the propyl chain used previously.…”