Synthesis and characterisation of epoxy–novolac/bismaleimide networks

Vanaja, A.; Rao, Raghavendra

doi:10.1016/s0014-3057(01)00094-5

Cited by 51 publications

(24 citation statements)

References 14 publications

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“…Similar observations were made earlier for the kinetic studies carried out on the amine cured epoxybismaleimide blend. 10 The peak reaction temperature indicated a marginal lowering tendency at high BMI concentration in the blend. This is a result of the increased concentration of aliphatic groups originated from the Alder-Ene reaction (Table III).…”

Section: Thermo Gravimetric Analysismentioning

confidence: 96%

Diallyl bisphenol A—novolac epoxy system cocured with bisphenol‐A‐bismaleimide—cure and thermal properties

Devi¹,

Nair²,

Ninan³

2007

J of Applied Polymer Sci

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Novolac epoxy (EPN)-2,2 0 -diallyl bisphenol A (DABA) resin system was modified by cocuring it with bisphenol A bismaleimide (BMI). Molar concentration of BMI in the stochiometric blend of EPN and DABA was varied from 0.5 to 2.0. The cure optimization was done using DSC, IR spectroscopy, and rheological studies. The curing proceeded by phenol-epoxy and Alder-ene reactions. The performance of the ternary Epoxy-Allyl phenolic-Bismaleimide system was evaluated through their thermal and dynamic mechanical characterization. BMI improved the overall thermal stability and the modulus of the result-ant composites. The increase in BMI concentration in the system resulted in enhanced glass transition temperature with a consequent improvement in high temperature performance typically estimated by their lap shear strength at high temperatures. The high temperature performance of the epoxy-phenol-bismaleimide (EPB) system was found to be far superior to the epoxy-phenol (EP)system.

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Section: Thermo Gravimetric Analysismentioning

confidence: 96%

Diallyl bisphenol A—novolac epoxy system cocured with bisphenol‐A‐bismaleimide—cure and thermal properties

Devi¹,

Nair²,

Ninan³

2007

J of Applied Polymer Sci

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“…These results are summarized in Table 4. The T g s of the epoxy resins cured with 0.1 g urea-formaldehyde and 0.1 g silicon are 300 and 3508C, respectively [21]. The molecular chains of epoxy containing 0.5 g urea-formaldehyde and 0.1 g silicon are more flexible than that of blank epoxy resin, as the chain length increases in order of the corresponding cured epoxy resin.…”

Section: Differential Scanning Calorimetery (Dsc)mentioning

confidence: 98%

Epoxy Resin-modified, Urea-formaldehyde/Silicon Networks for High Impact Strength and Thermal Stability

Athawale

Alhousami

2008

Journal of Reinforced Plastics and Composites

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A variety of toughening agents are used to modify epoxy resins that improve the fracture toughness of the epoxy systems. The basic goal in toughening cross-linked epoxy resins that are normally brittle at room temperature is to improve crack resistance and toughness without significantly decreasing other important inherent properties, such as the flexural modulus and the thermomechanical properties of the original epoxy resins.In the present study, thermally stable epoxy resin modified urea-formaldehyde/silicon blends have been prepared by in situ polymerization technique. The materials were modified with triethylenetetramine (hardener) to obtain highly cross-linked thermosetting resins. The physical properties of the resulting blends were evaluated by measuring the impact strength, which is found to be increased by more than 25% of that of the cured and blank epoxy resin. The impact fracture surfaces are examined using scanning electron microscopy (SEM) to reveal the morphological changes.The hardness was found to be high in the case of modified epoxy resin as compared to blank epoxy. The influence on the thermal properties and the behavior of different curing agents on resins were investigated by thermogravimetrc analysis (TGA) and differential scanning calorimetry (DSC). The results of the modified epoxy resins showed remarkably high thermal stability as well as a higher degree of solvent resistance as compared with blank epoxy resin.

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“…In the case of MH/BD resins, when the content of MHs is 1e3 wt%, their exothermic peaks shift toward low temperature direction, suggesting that MH/BD system can be cured at lower temperature than BD prepolymer. This is because the outer surface of MH contains some primary amine groups, which can catalyze the curing behavior of resins [32]. But when the content of MHs increases, the steric effect induced by the large number of microencapsules offsets the promotion effect of primary amine groups, so the exothermic peaks of MH/BD prepolymers slightly move toward higher temperature.…”

Section: Curing Behaviors Of Uncured Hpctp/bd Mh/bd and Bd Prepolymersmentioning

confidence: 99%

Fabrication and origin of new flame retarding bismaleimide resin system with low dielectric constant and loss based on microencapsulated hexaphenoxycyclotriphosphazene in low phosphorus content

Cao

Yuan

et al. 2015

Polymer Degradation and Stability

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Synthesis and characterisation of epoxy–novolac/bismaleimide networks

Cited by 51 publications

References 14 publications

Diallyl bisphenol A—novolac epoxy system cocured with bisphenol‐A‐bismaleimide—cure and thermal properties

Diallyl bisphenol A—novolac epoxy system cocured with bisphenol‐A‐bismaleimide—cure and thermal properties

Epoxy Resin-modified, Urea-formaldehyde/Silicon Networks for High Impact Strength and Thermal Stability

Fabrication and origin of new flame retarding bismaleimide resin system with low dielectric constant and loss based on microencapsulated hexaphenoxycyclotriphosphazene in low phosphorus content

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