Synergistic enhancement effect between external electric and magnetic fields during high power impulse magnetron sputtering discharge

Li, Chunwei; Tian, Xing; Gong, Chao; Xu, Jing; Liu, Shouxin

doi:10.1016/j.vacuum.2017.06.007

Cited by 4 publications

(2 citation statements)

References 27 publications

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“…This method allowed for a better distribution of the electric field and electric potential in the reactor, increased discharging, plasma intensification, and uni-directionality. The amplitude of the plasma density was five times greater in all positions when compared to the discharging without outer-field HiPIMS [98]. Figure 7 shows the vacuum system during HiPIMS discharge, measuring the ionic current of the substrate in different positions regarding both studies.…”

Section: Improvements and Applications Of External Devicesmentioning

confidence: 99%

Sputtering Physical Vapour Deposition (PVD) Coatings: A Critical Review on Process Improvement and Market Trend Demands

et al. 2018

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Physical vapour deposition (PVD) is a well-known technology that is widely used for the deposition of thin films regarding many demands, namely tribological behaviour improvement, optical enhancement, visual/esthetic upgrading, and many other fields, with a wide range of applications already being perfectly established. Machining tools are, probably, one of the most common applications of this deposition technique, sometimes used together with chemical vapour deposition (CVD) in order to increase their lifespan, decreasing friction, and improving thermal properties. However, the CVD process is carried out at higher temperatures, inducing higher stresses in the coatings and substrate, being used essentially only when the required coating needs to be deposited using this process. In order to improve this technique, several studies have been carried out optimizing the PVD technique by increasing plasma ionization, decreasing dark areas (zones where there is no deposition into the reactor), improving targets use, enhancing atomic bombardment efficiency, or even increasing the deposition rate and optimizing the selection of gases. These studies reveal a huge potential in changing parameters to improve thin film quality, increasing as well the adhesion to the substrate. However, the process of improving energy efficiency regarding the industrial context has not been studied as deeply as required. This study aims to proceed to a review regarding the improvements already studied in order to optimize the sputtering PVD process, trying to relate these improvements with the industrial requirements as a function of product development and market demand.

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Section: Improvements and Applications Of External Devicesmentioning

confidence: 99%

Sputtering Physical Vapour Deposition (PVD) Coatings: A Critical Review on Process Improvement and Market Trend Demands

et al. 2018

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show abstract

“…HiPIMS is an ionized PVD technique [6], during which sputtered atoms have a high degree of ionization, and their energy and trajectory can be modulated using an external electric or magnetic field [7][8]. This makes it possible to deposit dense and smooth coatings on complex-shaped substrates.…”

Section: Introductionmentioning

confidence: 99%

Deposition of titanium films on complex bowl-shaped workpieces using DCMS and HiPIMS

Xie¹,

Wei²,

Liu³

et al. 2022

Surface and Coatings Technology

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On the Physical Vapour Deposition (PVD): Evolution of Magnetron Sputtering Processes for Industrial Applications

Baptista

Silva

Porteiro

et al. 2018

Procedia Manufacturing

132

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Synergistic enhancement effect between external electric and magnetic fields during high power impulse magnetron sputtering discharge

Cited by 4 publications

References 27 publications

Sputtering Physical Vapour Deposition (PVD) Coatings: A Critical Review on Process Improvement and Market Trend Demands

Sputtering Physical Vapour Deposition (PVD) Coatings: A Critical Review on Process Improvement and Market Trend Demands

Deposition of titanium films on complex bowl-shaped workpieces using DCMS and HiPIMS

On the Physical Vapour Deposition (PVD): Evolution of Magnetron Sputtering Processes for Industrial Applications

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