2022
DOI: 10.1109/tia.2022.3186285
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Synergistic Effect of Nano-Silica and Micro-Silica Fillers on the Rheological and Thermal Properties of Epoxy Resins

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Cited by 4 publications
(2 citation statements)
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“…1 Epoxy (EP) is a commonly used insulation material in electronics packaging and power system apparatus because of easy processing, lower cost, and excellent electrical and physio-chemical properties. 2,3 However, it suffers from inferior thermal stability and thermal conductivity at high temperatures. 4 This results in poor heat dissipation during the equipment's operation, ultimately affecting its dielectric strength and lifetime.…”
Section: Introductionmentioning
confidence: 99%
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“…1 Epoxy (EP) is a commonly used insulation material in electronics packaging and power system apparatus because of easy processing, lower cost, and excellent electrical and physio-chemical properties. 2,3 However, it suffers from inferior thermal stability and thermal conductivity at high temperatures. 4 This results in poor heat dissipation during the equipment's operation, ultimately affecting its dielectric strength and lifetime.…”
Section: Introductionmentioning
confidence: 99%
“…Advancement in the third generation of electrical power equipment has put back a focus on developing reliable insulation packaging materials 1 . Epoxy (EP) is a commonly used insulation material in electronics packaging and power system apparatus because of easy processing, lower cost, and excellent electrical and physio‐chemical properties 2,3 . However, it suffers from inferior thermal stability and thermal conductivity at high temperatures 4 .…”
Section: Introductionmentioning
confidence: 99%