2016
DOI: 10.1016/j.compositesb.2015.08.074
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Synergic enhancement of thermal properties of polymer composites by graphene foam and carbon black

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Cited by 118 publications
(52 citation statements)
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“…Shtein et al developed graphene‐based hybrid composites with up to 90% reduced thermal resistances after the addition of a secondary ceramic‐based filler. Novel polymer composites consisting of graphene foam/carbon black/polydimethylsiloxane or graphene oxide/poly (vinylidene fluoride)/CNTs were also shown to greatly enhance the TC.…”
Section: New Methods To Control and Reduce The Itrmentioning
confidence: 99%
“…Shtein et al developed graphene‐based hybrid composites with up to 90% reduced thermal resistances after the addition of a secondary ceramic‐based filler. Novel polymer composites consisting of graphene foam/carbon black/polydimethylsiloxane or graphene oxide/poly (vinylidene fluoride)/CNTs were also shown to greatly enhance the TC.…”
Section: New Methods To Control and Reduce The Itrmentioning
confidence: 99%
“…The fact that polymerbased materials have low thermal conductivity (less than 10 W/m K even for most of the composite materials with high thermal conductivity fillers) (Ref [80][81][82][83][84] suggests that the non-dimensional parameter of time (t*) may also be smaller than 0.25 for many spray conditions on polymerbased materials. This may allow for the determination of the temperature distribution within polymeric substrates during the thermal spray metallization process by using the graph presented in Fig.…”
Section: Temperature Distribution Within the Polymer-based Substrate mentioning
confidence: 99%
“…Due to its high thermal stability, good mechanical properties and low dielectric constant, polydimethylsiloxane (PDMS) has been widely investigated as thermal interface materials. However, its TC is 0.1–0.2 Wm −1 K −1 at room temperature , which cannot meet the heat dissipation requirements of modern electronic components and electrical systems. Its low TC is attributed to the random orientation of molecular chains, leading to the reduction of the mean free path of heat conducting phonons .…”
Section: Introductionmentioning
confidence: 99%