“…Compared to electroplating, which may result in the build‐up of material at the edges and corners of the target substrate, and requires power supplies and conductive substrates, electroless plating has several advantages; it (i) is a simple one‐pot, solution‐based approach that uses a redox reaction to deposit metal directly, (ii) is cost effective, as it does not involve power supplies and other instrumentation, (iii) is applicable to the generation of uniform coatings on complicated shapes, and (iv) is able to coat nonconductive substrates, including, numerous plastics (e.g., polycarbonate, acrylonitrile–butadiene–styrene), glass, and elastomeric materials . Additionally, electroless deposition has key practical advantages over other popular metallization techniques, such as chemical vapor deposition, thermal spray methods, and physical vapor deposition, including: the ability to (i) deposit inorganic material selectively on the substrates without the need for lithography, and (ii) operate using simple, low‐cost processing equipment. Accordingly, electroless deposition is ubiquitous in electronics, and more generally to the manufacture of, for example, decorative or protective coatings, packaging paper, etc…”