2018
DOI: 10.1186/s11671-018-2743-7
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Switching Failure Mechanism in Zinc Peroxide-Based Programmable Metallization Cell

Abstract: The impact of peroxide surface treatment on the resistive switching characteristics of zinc peroxide (ZnO2)-based programmable metallization cell (PMC) devices is investigated. The peroxide treatment results in a ZnO hexagonal to ZnO2 cubic phase transformation; however, an excessive treatment results in crystalline decomposition. The chemically synthesized ZnO2 promotes the occurrence of switching behavior in Cu/ZnO2/ZnO/ITO with much lower operation current as compared to the Cu/ZnO/ITO (control device). How… Show more

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Cited by 29 publications
(15 citation statements)
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References 46 publications
(50 reference statements)
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“…It can be seen that the device-C has relatively high slopes of R on and R off distributions and a small coefficient of variation σ/μ. In consequence, stable and uniform distributions of LRS and HRS comparing with the other devices can be obtained by the gradual SET and RESET operations, this can be attributed to the perpendicular ZnO grain orientation under Li-doped synergistic effect being beneficial for ensuring that the formation and rupture of the conducting filaments caused by the carriers drift along the (002) grain boundaries under an electric field [35]. Thus, it is possible for the device-C to realize a better high-switching uniformity of the LRS and HRS resistance, a high switching current ratio, low set and reset voltages.…”
Section: Resultsmentioning
confidence: 99%
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“…It can be seen that the device-C has relatively high slopes of R on and R off distributions and a small coefficient of variation σ/μ. In consequence, stable and uniform distributions of LRS and HRS comparing with the other devices can be obtained by the gradual SET and RESET operations, this can be attributed to the perpendicular ZnO grain orientation under Li-doped synergistic effect being beneficial for ensuring that the formation and rupture of the conducting filaments caused by the carriers drift along the (002) grain boundaries under an electric field [35]. Thus, it is possible for the device-C to realize a better high-switching uniformity of the LRS and HRS resistance, a high switching current ratio, low set and reset voltages.…”
Section: Resultsmentioning
confidence: 99%
“…The above analysis indicates that the formation and rupture of the Ag based conduct filaments (CFs) are responsible for the resistive switching behaviors of devices [35]. The schematics of the resistive switching mechanism models under different applied DC voltages are shown in Figure 8.…”
Section: Resultsmentioning
confidence: 99%
“…The conductive-bridge type memristor utilizes the electrochemical metallization process where the atoms from the active electrode (Cu, Ag, or Ni) drift to the switching layer and form the conduction bridge (filament) [22,23]. A diffusion barrier is usually employed in this type of memristor device to control the atomic drift [24,25].…”
Section: Cation Drift Barrier Layermentioning
confidence: 99%
“…Massive production of RRAMs has been limited by their inherent stochastic features, such as probabilistic switching, inter-and intra-device variability and RTN [10]. Extensive research effort is currently devoted to overcoming these limitations [11,12]. However, the very same challenges provide interesting features for the generation of random numbers in hardware security applications [13].…”
Section: Introductionmentioning
confidence: 99%