Sweeping total reflection X-ray fluorescence optimisation to monitor the metallic contamination into IC manufacturing

X-ray Spectrometry

“…Therefore, analytical information of any surface contaminants on a large Si water is obtained within a short measuring time. Borde et al studied the optimization of this technique to monitor the presence of metallic contaminants (198). The authors investigated SP-TXRF in comparison with normal direct TXRF (D-TXRF) in relation to throughput, detection limits, surface coverage, accuracy, quantification, etc.…”

“…TXRF mapping of a wafer contaminated with 10 Mn spots: (a) 10 points D-TXRF centered above spots and (b) various SP-TXRF. Reprinted from (ref ) Spectrochim. Acta, Part B , 63, Borde, Y.; Danel, A.; Roche, A.; Veillerot, M. Sweeping total reflection X-ray fluorescence optimisation to monitor the metallic contamination into IC manufacturing, 1370−1374, Copyright 2008, with permission from Elsevier.…”

Surface Potential Difference Imaging Applied to Wet Clean Monitoring

“…The range of the signal in regions of interest was plotted against TXRF data (corrected to take into account the spot size impact on quantitative data, i.e. about a factor 2 for 1 cm 2 spots, after [4]). Similarly, the range of the signal in clean areas was measured on several wafers to take into account background variation on the estimation of the lowest detectable levels of contamination.…”

“…Today, the main methods used in clean rooms are visual inspection by light scattering (principally applied to particle detection) and metallic contamination detection by Total-reflection X-Ray Fluorescence (TXRF). These methods, despite good sensitivity and recent progress [3,4] are not sufficient, especially considering non-visual defects not measurable by light scattering, nor TXRF due to their chemical nature or to their size and location (TXRF is not applicable to light elements -with Z < 11 -and is typically a 1 cm resolution tool, with 1 to 2 cm edge exclusion). Non-vibrating Surface Potential Difference Imaging (SPDI), introduced in 2005 under the name of ChemetriQ® is an in-line, non-contact, nondestructive inspection technique based on the imaging of surface Work Function (WF) lateral nonuniformities [5].…”

Cleanliness Management in Advanced Microelectronic

“…-An improvement of metallic contamination metrology. Up to date TXRF tools offer quantitative analyses on entire wafer [6] for global and local concentration [7][8]. Furthermore, a novel full wafer inspection technology for non-visual residues has been recently proposed: the ChemitriQ ® method [9].…”