2018
DOI: 10.1109/comst.2018.2839672
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Survey of Photonic and Plasmonic Interconnect Technologies for Intra-Datacenter and High-Performance Computing Communications

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Cited by 114 publications
(51 citation statements)
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“…It is the aim of this comprehensive survey then, to highlight the key roles of plasmon based technologies on equipping future competitive THz nanoscale communication systems hosting wireless THz nanoapplications, namely NoCs, WNSNs and beyond 5G communications. This survey paper may be well considered as a complementary work of [15], which had emphasized on key roles of plasmonics and silicon photonics, on equipping wired ultra-high bit rate interconnects, ranging from nanoscale intra and inter-chip interconnections, up to board to board and rack to rack interconnections between data centers (DCs).Particularly, the current work aims to complete the fundamental roles of plasmonic elements and mechanisms referred in the previous work, by associating the currently under investigation, THz system infrastructure in wireless communications. The potential of the THz communications is highlighted by illustrating the basic design issues in equipping these three important THz applications, that will define future wireless application demands coping with users' needs.…”
mentioning
confidence: 99%
“…It is the aim of this comprehensive survey then, to highlight the key roles of plasmon based technologies on equipping future competitive THz nanoscale communication systems hosting wireless THz nanoapplications, namely NoCs, WNSNs and beyond 5G communications. This survey paper may be well considered as a complementary work of [15], which had emphasized on key roles of plasmonics and silicon photonics, on equipping wired ultra-high bit rate interconnects, ranging from nanoscale intra and inter-chip interconnections, up to board to board and rack to rack interconnections between data centers (DCs).Particularly, the current work aims to complete the fundamental roles of plasmonic elements and mechanisms referred in the previous work, by associating the currently under investigation, THz system infrastructure in wireless communications. The potential of the THz communications is highlighted by illustrating the basic design issues in equipping these three important THz applications, that will define future wireless application demands coping with users' needs.…”
mentioning
confidence: 99%
“…A promising technology is optical interconnects [154,170] that replace traditional copper wires by optical links. Optical interconnects could potentially offer lower latency, lower power consumption, and higher throughput than current solutions.…”
Section: Photonicsmentioning
confidence: 99%
“…P I and P O represent stages without OSEs, these two stages are a combination of straight and crossing waveguides and are represented using Equations (7) and (8), respectively. P I is a column permutation matrix while P O is a row permutation matrix.…”
Section: Six-port Non-blocking Reconfigurable Optical Switch Architecmentioning
confidence: 99%
“…However, the future requirements for the above-mentioned applications cannot be fulfilled using conventional on-chip electrical interconnects [5,6]. The International Technology Roadmap for Semiconductors (ITRS) has acknowledged ONoCs as a substitute to overcome the limitations of traditional on-chip interconnects [7]. Silicon photonics can deliver higher on-chip communication bandwidth by exploiting wavelength division multiplexing (WDM) with lower latency and power consumption, and can achieve a bandwidth of terabits per second (Tbps) [8][9][10].…”
Section: Introductionmentioning
confidence: 99%