Surface-semiconductive polyimide films containing tin complexes

Ezzell, Stephen A.; Taylor, Larry T.

doi:10.1021/ma00138a035

Cited by 19 publications

(10 citation statements)

References 3 publications

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“…In some of the earlier studies (before 1990), the incorporation of metal oxides was frequently not very successful, yielding inhomogeneous distributions of particles (markedly higher concentrations at or near the polymer surfaces. − ) In many cases, agglomeration of the inorganic particles degraded the properties of the resulting materials. In 1990, however, McGrath and co-workers reported the synthesis of functionalized PI oligomers capable of bonding themselves into sol−gel networks.…”

Section: Some Attempts At Compatibilizationmentioning

confidence: 99%

Polyimide−Ceramic Hybrid Composites by the Sol−Gel Route

2001

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A number of polyimides have gained considerable importance as high-performance polymers during the last 2 decades primarily because of their excellent thermal stability and toughness. Some applications, however, require property enhancements and the desired improvements can often be obtained through incorporation of ceramic-like particles such as silica. Such hybrid inorganic−organic composites are frequently obtained using the in situ generation of the dispersed inorganic phase by the sol−gel technique. A number of studies have now been carried out on the preparation and characterization of such hybrid polyimide composites, and the purpose of this review is to give a brief account of the strategies used for this purpose and to describe some of the properties of the resulting composites.

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Section: Some Attempts At Compatibilizationmentioning

confidence: 99%

Polyimide−Ceramic Hybrid Composites by the Sol−Gel Route

2001

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“…The distribution of silica particles in the hybrid prepared by this method was not uniform and the particle size was about several micrometers at higher silica content. [13][14][15][16] Later, to achieve a better distribution of nanometer-sized inorganic particles in PI matrices, attention was given to enhance the compatibility of organic and inorganic phases and the following three approaches were taken by the researchers in this field.…”

Section: Introductionmentioning

confidence: 99%

Properties of Polyimide/Silica Nanohybrids from Silicic Acid Oligomer

Wang

Zhong

et al. 2004

Macro Materials & Eng

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Summary: A new method to synthesize polyimide (PI)/silica nanohybrids has been presented. It uses silicic acid oligomer as the silica precursor, which was obtained by extracting with tetrahydrofuran (THF) from PH‐adjusted water glass. The films of PI/silica nanohybrids remained transparent even at high silica content due to the formation of nanometer‐scaled SiO2 particles at the addition of γ‐aminopropyltriethoxysilane (APTES). In comparison with pure PI, PI/silica hybrids showed improved thermal stability and mechanical properties, and lower linear coefficients of thermal expansion (CTEs). The glass transition temperatures of the hybrids were increased with increasing content of silica or APTES as a result of the increasing limitation to the movements of the PI backbone.SEM photograph of PI 20/4.magnified imageSEM photograph of PI 20/4.

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“…Metal-containing polyimides were first reported by Angelo, who added organometallic complexes to several types of polyimides and reported the metallic contents, dielectric constants, and volume resistivity for the copper-containing polyimides. Polyimide films containing metal/metal oxide particles generated in situ have been studied extensively by Taylor with several collaborative teams in an attempt to synthesize materials with unique electrical, magnetic, thermal, or adhesive properties. − They have incorporated more than 20 metallic salts and organometallic complexes in aromatic polyimides. Dianhydrides and diamines that have ether (−O−), thioether (−S−), and carbonyl (−CO−) linkages, such as 3,3‘,4,4‘-benzophenonetetracarboxylic acid dianhydride (BTDA), 4,4‘-bis(3,4-dicarboxyphenoxy)diphenyl sulfide (BDSDA), 4,4‘-oxydianiline (ODA), and 4,4‘-diaminodiphenyl sulfide (DDS) were used.…”

Section: Introductionmentioning

confidence: 99%

Synthesis, Characterization, and Optical Properties of Metal-Containing Fluorinated Polyimide Films

Sawada

Ando

1998

Chem. Mater.

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Five kinds of metal-containing fluorinated polyimide films were prepared by thermal curing of poly(amic acid)s containing metallic salts or organometallic complexes. The chemical states, average sizes, and spatial distribution of the metallic particles were examined, and the thermal and optical properties of the films were compared with those of the colorless host polyimide. For characterizing the metal-containing polyimide films, measurements of refractive indices and wide-angle X-ray diffraction were newly applied. Copper and palladium complexes were fully or partially oxidized to form metal oxide particles, and silver complexes and gold salts were converted into metal particles after thermal imidization. All the films were much less transparent in the visible region than the host polyimide. However, the metal-containing films, except for the gold-containing film, transmitted higher than 80% at 1550 nm near-infrared. The precipitated silver and gold particles increased the average refractive indices of the polyimides.

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Surface-semiconductive polyimide films containing tin complexes

Cited by 19 publications

References 3 publications

Polyimide−Ceramic Hybrid Composites by the Sol−Gel Route

Polyimide−Ceramic Hybrid Composites by the Sol−Gel Route

Properties of Polyimide/Silica Nanohybrids from Silicic Acid Oligomer

Synthesis, Characterization, and Optical Properties of Metal-Containing Fluorinated Polyimide Films

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