“…Metal-containing polyimides were first reported by Angelo, who added organometallic complexes to several types of polyimides and reported the metallic contents, dielectric constants, and volume resistivity for the copper-containing polyimides. Polyimide films containing metal/metal oxide particles generated in situ have been studied extensively by Taylor with several collaborative teams in an attempt to synthesize materials with unique electrical, magnetic, thermal, or adhesive properties. − They have incorporated more than 20 metallic salts and organometallic complexes in aromatic polyimides. Dianhydrides and diamines that have ether (−O−), thioether (−S−), and carbonyl (−CO−) linkages, such as 3,3‘,4,4‘-benzophenonetetracarboxylic acid dianhydride (BTDA), 4,4‘-bis(3,4-dicarboxyphenoxy)diphenyl sulfide (BDSDA), 4,4‘-oxydianiline (ODA), and 4,4‘-diaminodiphenyl sulfide (DDS) were used.…”