Surface resistivity and bonding strength of atmosphere plasma sprayed copper‐coated alumina substrate

Abstract

Ceramic substrate metallization is widely used in electronic device packaging and ceramic circuit board. Currently used methods of ceramic metallization are thick film technology (TFC), activity metal blazing (AMB), direct bonded copper (DBC), and direct plated copper (DPC) etc Here we report a facile approach for the metallization of alumina substrate using an atmosphere plasma spray (APS) process. The APS-coated copper layer is dense, high purity, and attached very firmly with alumina How to cite this article: Liu G, Zhong X, Xing Y, Li T, Pan W. Surface resistivity and bonding strength of atmosphere plasma sprayed copper-coated alumina substrate.

Corrosion Behavior of the CoNiCrAlY-Al2O3 Composite Coating Based on Core-Shell Structured Powder Design

“…There are few semi-melted particles and unmelted particles inside the coating. The bonding interface between the stainless steel substrate and the coating occludes each other, indicating a high bonding strength [32]. However, the CoNiCrAlY-Al2O3 coating prepared with the core-shell structured powder exhibits a completely different microstructure.…”

“…There are few semi-melted particles and unmelted particles inside the coating. The bonding interface between the stainless steel substrate and the coating occludes each other, indicating a high bonding strength[32].…”

Atmospheric plasma spraying to fabricate metal‐supported solid oxide fuel cells with open‐channel porous metal support

“…To overcome the aforementioned challenges, the atmospheric plasma spraying (APS) technique has been explored for manufacturing SOFCs 16–19 . The APS process utilizes high‐temperature plasma flame created by a plasma torch to fully or partially melt particles that are subsequently deposited on a substrate 20,21 . Compared with other deposition methods such as chemical vapor deposition, 22 pulsed laser deposition, 23 vacuum plasma spraying 24,25 and suspension plasma spray, 26 APS offers an ideal cost‐effective solution for iterative processes at high volume productions and fast production rates, thus minimizing the potential reactions/interdiffusions among different SOFC layers at lower temperatures without additional heat treatment.…”

“…[16][17][18][19] The APS process utilizes high-temperature plasma flame created by a plasma torch to fully or partially melt particles that are subsequently deposited on a substrate. 20,21 Compared with other deposition methods such as chemical vapor deposition, 22 pulsed laser deposition, 23 vacuum plasma spraying 24,25 and suspension plasma spray, 26 APS offers an ideal cost-effective solution for iterative processes at high volume productions and fast production rates, thus minimizing the potential reactions/interdiffusions among different SOFC layers at lower temperatures without additional heat treatment. Furthermore, the APS process can easily control the composition and microstructure of sprayed layers by adjusting the spraying parameters.…”