Surface plasmon damping effects due to Ti adhesion layer in individual gold nanodisks

Debu, Desalegn T.; Ghosh, Pijush K.; French, David; Herzog, Joseph B.

doi:10.1364/ome.7.000073

Cited by 38 publications

(27 citation statements)

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“…To reduce the percolation threshold of ultrathin gold films, adhesion or seed layers of Ti, Cr, Ni, Pt, or Ge are commonly used. However, these adhesion layers significantly affect the optical and electrical properties of ultrathin metal nanostructures . Recently, the organosilane‐based adhesion layers (mercaptosilanes and aminosilanes) were used for the deposition of sub‐10 nm thick continuous Au films on silicon and glass surfaces .…”

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confidence: 99%

Ultrathin and Ultrasmooth Gold Films on Monolayer MoS₂

Yakubovsky

Stebunov

Kirtaev

et al. 2019

Adv Materials Inter

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films are also the key element of plasmonic waveguides [10,11] and hyperbolic metamaterials. [12,13] Growth of continuous and ultrathin gold films on different substrates, such as glass, silicon oxide, silicon nitride, graphene etc. is notoriously difficult due to the poor wetting of gold to these substrates. [14,15] The growth kinetics of metal films is generally determined by the adsorption and diffusion behavior of metal adatoms on the substrate. A small ratio of the adsorption energy of metal adatoms on the substrate to the bulk cohesive energy of the metal and low diffusion barrier for an adatom favor the 3D island growth behavior also known as the Volmer-Weber growth mode. [16] Within the framework of this growth model, the formation of a metal film is associated with the following stages: nucleation of islands, island growth, island impingement and coalescence, percolation, and channel filling to finally form a continuous thin film. To reduce the percolation threshold of ultrathin gold films, adhesion or seed layers of Ti, Cr, Ni, Pt, or Ge are commonly used. However, these adhesion layers significantly affect the optical and electrical properties of ultrathin metal nanostructures. [17][18][19][20][21][22] Recently, the organosilane-based adhesion layers (mercaptosilanes and aminosilanes) were used for the deposition of sub-10 nm thick continuous Au films on silicon and glass surfaces. [23][24][25][26][27] However, organosilanes are not compatible with nonoxidized silicon surfaces and poorly compatible with standard lift-off procedures, that imposes severe limitations to their use as adhesion layers. [21] Adhesion layers based on organosilanes are also inefficient for the deposition of atomically thin metal films [14] and does not move us closer to the deposition of 2D layers from bulk plasmonic metals. Actually, the latter seems now as impossible as the deposition of atomically thin carbon films had been considered before 2004. [28] In the present paper, we propose the use of MoS 2 monolayer as an entirely new type of "universal" (i.e., it can be transferred to any arbitrary substrate) [29][30][31] adhesion layer for ultrathin (<10 nm) high-quality continuous gold films. To test the feasibility of this idea, we deposited ultrathin gold films of different thicknesses onto monolayer MoS 2 , grown on silicon dioxide substrates (Figure 1a), and studied their structural and optical properties.An electron beam evaporator Nano Master NEE-4000 was used to deposit Au films on top of atmospheric pressure CVD (APCVD)-grown full area coverage MoS 2 monolayers on silicon wafers with a 285 nm thick SiO 2 coating (from 2D semiconductors Inc.). The deposition was performed at Sub-10 nm continuous metal films are promising candidates for flexible and transparent nanophotonics and optoelectronic applications. In this article, it is demonstrated that monolayer MoS 2 is a perspective adhesion layer for the deposition of continuous conductive gold films with a thickness of only 3-4 nm. Optical properties of continuous ultrath...

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confidence: 99%

Ultrathin and Ultrasmooth Gold Films on Monolayer MoS₂

Yakubovsky

Stebunov

Kirtaev

et al. 2019

Adv Materials Inter

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“…Since Ti has a much larger imaginary dielectric function component than that of gold, it contributes to more plasmonic damping in the nanostructure. 53 Additionally, the hotspot at the edge of the Au structure is moved away from the GaAs layer with increasing Ti layer thickness, decreasing the optical enhancement in the GaAs. Charge interactions between the Ti/Au interfaces can also lead to further plasmonic damping.…”

Section: Resultsmentioning

confidence: 99%

“…Charge interactions between the Ti/Au interfaces can also lead to further plasmonic damping. 53 As the plasmon is damped, the enhancement is decreased.…”

Section: Resultsmentioning

confidence: 99%

Modeling and optimization of Au-GaAs plasmonic nanoslit array structures for enhanced near-infrared photodetector applications

et al. 2017

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, "Modeling and optimization of Au-GaAs plasmonic nanoslit array structures for enhanced near-infrared photodetector applications," J. Nanophoton. 11(1), 016017 (2017), doi: 10.1117/1.JNP.11.016017. Abstract. This theoretical work explores how various geometries of Au plasmonic nanoslit array structures improve the total optical enhancement in GaAs photodetectors. Computational models studied these characteristics. Varying the electrode spacing, width, and thickness drastically affected the enhancement in the GaAs. Peaks in enhancement decayed as Au widths and thicknesses increased. These peaks are resonant with the incident near-infrared wavelength. The enhancement values were found to increase with decreasing electrode spacing. Additionally, a calculation was conducted for a model containing Ti between the Au and the GaAs to simulate the necessary adhesion layer. It was found that optical enhancement in the GaAs decreases for increasing Ti layer thickness. Optimal dimensions for the Au electrode include a width of 240 nm, thickness of 60 nm, electrode spacing of 5 nm, and a minimum Ti thickness. Optimal design has been shown to improve enhancement to values that are up to 25 times larger than for nonoptimized geometries and up to 300 times over structures with large electrode spacing. It was also found that the width of the metal in the array plays a more significant role in affecting the field enhancement than does the period of the array. © The Authors. Published by SPIE under aCreative Commons Attribution 3.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.

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“…Previous work studying the effects of a Ti adhesion layer on the plasmonic response of an Au nanostructure to incident light illumination has shown that the optical enhancement produced by the structures decreases with increasing Ti layer thickness. [64][65][66][67][68] Therefore, for optical applications, ideally no adhesion layer would be used, but in the case in which it is required, the smallest possible adhesion layer should be used to preserve the optical characteristics of the patterned structures. The thickness of the Au layer has also been found to significantly affect the optical response of a patterned nanostructure, with and without nanoslits.…”

Section: Nanomasking Fabricationmentioning

confidence: 99%

Fabrication and analysis of metallic nanoslit structures: advancements in the nanomasking method

Bauman

Darweesh

Debu

et al. 2018

J. Micro/Nanolith. MEMS MOEMS

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, "Fabrication and analysis of metallic nanoslit structures: advancements in the nanomasking method," J. Micro/Nanolith. MEMS MOEMS 17(1), 013501 (2018), doi: 10.1117/1.JMM.17.1.013501. Abstract. This work advances the fabrication capabilities of a two-step lithography technique known as nanomasking for patterning metallic nanoslit (nanogap) structures with sub-10-nm resolution, below the limit of the lithography tools used during the process. Control over structure and slit geometry is a key component of the reported method, exhibiting the control of lithographic methods while adding the potential for mass-production scale patterning speed during the secondary step of the process. The unique process allows for fabrication of interesting geometric combinations such as dual-width gratings that are otherwise difficult to create with the nanoscale resolution required for applications, such as nanoscale optics (plasmonics) and electronics. The method is advanced by introducing a bimetallic fabrication design concept and by demonstrating blanket nanomasking. Here, the need for the secondary lithography step is eliminated improving the mass-production capabilities of the technique. Analysis of the gap width and edge roughness is reported, with the average slit width measured at 7.4 AE 2.2 nm. It was found that while no long-range correlation exists between the roughness of either gap edge, and there are ranges in the order of tens of nanometers over which the slit edge roughness is correlated or anticorrelated across the gap. This work helps quantify the nanomasking process, which aids in future fabrications and leads toward the development of more accurate computational models for the optical and electrical properties of fabricated devices. © The Authors. Published by SPIE under a Creative Commons Attribution 3.0 UnportedLicense. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.

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Surface plasmon damping effects due to Ti adhesion layer in individual gold nanodisks

Cited by 38 publications

References 65 publications

Ultrathin and Ultrasmooth Gold Films on Monolayer MoS₂

Ultrathin and Ultrasmooth Gold Films on Monolayer MoS₂

Modeling and optimization of Au-GaAs plasmonic nanoslit array structures for enhanced near-infrared photodetector applications

Fabrication and analysis of metallic nanoslit structures: advancements in the nanomasking method

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Surface plasmon damping effects due to Ti adhesion layer in individual gold nanodisks

Cited by 38 publications

References 65 publications

Ultrathin and Ultrasmooth Gold Films on Monolayer MoS2

Ultrathin and Ultrasmooth Gold Films on Monolayer MoS2

Modeling and optimization of Au-GaAs plasmonic nanoslit array structures for enhanced near-infrared photodetector applications

Fabrication and analysis of metallic nanoslit structures: advancements in the nanomasking method

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Ultrathin and Ultrasmooth Gold Films on Monolayer MoS₂

Ultrathin and Ultrasmooth Gold Films on Monolayer MoS₂