Extended Abstracts of the 1992 International Conference on Solid State Devices and Materials 1992
DOI: 10.7567/ssdm.1992.pc2-4
|View full text |Cite
|
Sign up to set email alerts
|

Surface Passivation of In0.52Al0.48As Using (NH4)2Sx and P2S5/(NH4)2S

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

1999
1999
2013
2013

Publication Types

Select...
2

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(1 citation statement)
references
References 0 publications
0
1
0
Order By: Relevance
“…In this study, the effect of rapid thermal annealing (RTA) is neglected, since the annealing would regrow certain oxides at the interface. For example, As–S bonds start to disappear when the temperature attains 300°C, and at this point the As oxides are likely to be formed [29]. However, Ga–S is really stable at high temperature and can stand up to 500°C [23].…”
Section: Resultsmentioning
confidence: 99%
“…In this study, the effect of rapid thermal annealing (RTA) is neglected, since the annealing would regrow certain oxides at the interface. For example, As–S bonds start to disappear when the temperature attains 300°C, and at this point the As oxides are likely to be formed [29]. However, Ga–S is really stable at high temperature and can stand up to 500°C [23].…”
Section: Resultsmentioning
confidence: 99%