2011
DOI: 10.1016/j.solmat.2010.04.049
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Surface passivation of crystalline silicon wafer via hydrogen plasma pre-treatment for solar cells

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Cited by 12 publications
(6 citation statements)
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“…In addition, the reconstruction of the silicon surface have been considered as another use of the hydrogen plasma treatment, , but its influence on the subsequently deposited thin film passivation layer has not been investigated. Kim et al found that the decrease in the silicon surface recombination velocity after hydrogen plasma treatment was caused by the increased hydrogen concentration at the silicon surface. Although the results described above suggest that surface treatment by hydrogen plasma promotes device performance, the mechanism by which hydrogen plasma pretreatment improves surface passivation of c-Si remains unclear, especially for SHJ solar cells applications.…”
Section: Introductionmentioning
confidence: 99%
“…In addition, the reconstruction of the silicon surface have been considered as another use of the hydrogen plasma treatment, , but its influence on the subsequently deposited thin film passivation layer has not been investigated. Kim et al found that the decrease in the silicon surface recombination velocity after hydrogen plasma treatment was caused by the increased hydrogen concentration at the silicon surface. Although the results described above suggest that surface treatment by hydrogen plasma promotes device performance, the mechanism by which hydrogen plasma pretreatment improves surface passivation of c-Si remains unclear, especially for SHJ solar cells applications.…”
Section: Introductionmentioning
confidence: 99%
“…The substrate was immediately loaded into the sputtering chamber and exposed to FG plasma (FGP) at room temperature in order to induce hydrogen onto the substrate surface. 19) SiN x :H film was then deposited at room temperature. Tables I and II show the standard conditions of the FGP and sputtering process, respectively.…”
Section: Experimental Methodsmentioning
confidence: 99%
“…Species produced in NH 3 plasma can be used for surface etching and removing undesired oxides or deposits, such as As 2 O 3 and a‐C:H . By removing such impurities, one can achieve passivation of the material surface . Etching effects of ammonia plasma were also studied on organic low k films …”
Section: Introductionmentioning
confidence: 99%