Surface micromachining of UV transparent materials

Kopitkovas, G.; Lippert, Thomas; Dávid, Christian; Wokaun, Alexander; Gobrecht, J.

doi:10.1016/j.tsf.2003.11.074

Cited by 62 publications

(27 citation statements)

References 13 publications

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“…The first one is that the fluence -etch rate graphs can be fitted by two straight lines. This behavior was observed by many research groups [13][14][27][28][29][30][31][32], but correct, coherent explanation have not existed yet. We have already presented a LIBWE model in our previous papers [15,27], which gave relatively good results for LIBWE applying ArF laser (nevertheless the calculated threshold fluence was higher than the measured one), but this model did not work for KrF experiments, namely etching was not predicted in the applied fluence range (up to ≈2 J/cm 2 ).…”

Section: Introductionmentioning

confidence: 81%

Interpretation and Modeling of Laser-Induced Backside Wet Etching Procedure

Vass

Budai

Schay

et al. 2010

JLMN

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Laser-induced backside wet etched fused silica surfaces were characterized by X-ray photoelectron spectroscopy (XPS) and ellipsomerty, and a new numerical model was developed to interpret the etching procedure on the basis of our recent results. ArF and KrF lasers were used for etching, while the applied liquid absorbers were naphthalene/methyl-methacrylate and pyrene/acetone solutions. The XPS measurements showed that the completely cleaned, etched fused silica surface layers were contaminated by carbon (which originated from the organic absorber molecules). The optical parameters of the modified layers were measured by spectroscopic ellipsometer. The thicknesses of these carbon contaminated layers were very thin (between 10 and 30 nm), while their absorption coefficient and the refractive index at 248 nm were between 100 000 and 180 000 cm -1 , and 1.85, respectively. Our previous numerical model was completed on the basis of the determined properties of this modified layer, and our results proved that this layer plays key role in the etching procedure.

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Section: Introductionmentioning

confidence: 81%

Interpretation and Modeling of Laser-Induced Backside Wet Etching Procedure

Vass

Budai

Schay

et al. 2010

JLMN

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“…This control allowed us to determine if the UV protectiveness of the eggshells is the result of its chemical and/or physical properties rather than the effect of simply representing a physical barrier thick enough to block or filter the passage of light. We used quartz as it does not interfere with UV wavelengths [18] and the exclusive effect of the material thickness can be tested.…”

Section: Specimen Installationmentioning

confidence: 99%

Exploring the Use of Unprocessed Waste Chicken Eggshells for UV-Protective Applications

2017

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Photodegradation causes a steady loss of the useful physical, mechanical and optical properties of materials, necessitating their replacement over time. Because UV (Ultraviolet) light is most harmful in this regard, many materials now contain UV-protective additives. However, these additives are not always effective and durable, can be expensive, and their natural extraction or synthetic production can be harmful to the environment. Here, we investigated the use of unprocessed chicken eggshells in providing UV protection to two commonly used synthetic polymers: polystyrene and nylon. We show that unprocessed chicken eggshells provide a durable and effective UV protection. Our data sets the stage for future research to find a practical way to use the large amounts of unprocessed chicken eggshell waste as novel, economically appealing and environmentally friendly UV-protective additives.

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“…In Table 1, the most important characteristics of patterning processes for transparent materials are listed for H-and M-LIBWE in comparison to laser ablation. All the mentioned backside etching techniques have been used for micro-and nanopatterning of different transparent glass and crystals [22,23,[41][42][43]. Examples are the etching of submicron and nanometer gratings in fused silica [44][45][46] and sapphire [47], the submicron patterning on-thefly with one laser pulse [48], the etching of micro-optical elements [18,39,42,[49][50][51][52][53], and the fabrication of arrays for biomedical purposes [30,54].…”

Section: Introductionmentioning

confidence: 99%

Laser-Induced Backside Wet Etching of Transparent Materials with Organic and Metallic Absorbers

Zimmer

Böhme

2008

Laser Chemistry

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Recommended by Jacques AlbertLaser-induced backside wet etching (LIBWE) allows the high-quality etching of transparent materials for micro-and nanopatterning. Recent own results of LIBWE with hydrocarbon and metallic absorbers (H-and M-LIBWE) are summarized and compared with selected results of other groups regarding the etching process and the etched surface. Significant results on the impact of the liquid absorber, the material and the wavelength, and the pulse length of the laser to the etching are selected for this comparison. The etching of submicron-sized periodic structures in sapphire and fused silica with interference techniques and the selection of the preferred method in dependence on the material and the processing goal discussed. The experimental results are discussed on a thermal model considering both interface and volume absorption of the laser beam. These results have the conclusion that the etching at M-LIBWE is mainly due to material melting and evaporation whereas at H-LIBWE, a modified near-surface region with a very high absorption is ablated.

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Surface micromachining of UV transparent materials

Cited by 62 publications

References 13 publications

Interpretation and Modeling of Laser-Induced Backside Wet Etching Procedure

Interpretation and Modeling of Laser-Induced Backside Wet Etching Procedure

Exploring the Use of Unprocessed Waste Chicken Eggshells for UV-Protective Applications

Laser-Induced Backside Wet Etching of Transparent Materials with Organic and Metallic Absorbers

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