Surface micro-texturing of metallic cylindrical surface with proximity rolling-exposure lithography and electrochemical micromachining

Hao, Xiaohong; Wang, Li; Wang, Quandai; Guo, Feng; Tang, Yiping; Ding, Yucheng; Lu, Bingheng

doi:10.1016/j.apsusc.2011.05.061

Cited by 49 publications

(24 citation statements)

References 35 publications

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“…Using this method, Madore and Landolt [11] fabricated arrays of hemispherical cavities on titanium. Hao et al [12] fabricated microstructures on cylindrical workpieces. Chauvy and Landolt [13] presented a new variation of the TMEMM of titanium using a laser-patterned oxide film.…”

Section: Introductionmentioning

confidence: 99%

Removal of islands from micro-dimple arrays prepared by through-mask electrochemical micromachining

Chen

et al. 2015

Precision Engineering

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Section: Introductionmentioning

confidence: 99%

Removal of islands from micro-dimple arrays prepared by through-mask electrochemical micromachining

Chen

et al. 2015

Precision Engineering

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“…Hao et al [9] used TMEMM to fabricate micro-dimples on a cylindrical surface at a feature size of 40 μm. Qu et al [10] prepared a micro-dimple of 94 μm diameter and 22.7 μm depth on a cylindrical surface using TMEMM with a dry-film mask.…”

Section: Introductionmentioning

confidence: 99%

Sandwich-like electrochemical micromachining of micro-dimples

Zhang

Chen

2016

Surface and Coatings Technology

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“…Through-mask electrochemical micromachining (TMEMM) is an EMM method that is commonly used to generate microdimple arrays with controlled size, location, and density. Hao et al [10] used TMEMM to fabricate micro-dimple arrays on a cylindrical surface at a feature size of 40 μm. Chen et al [11] reported the application of a polydimethysiloxane mask for the production of a micro-dimple array 61.5 μm in diameter and 3 μm in depth by using TMEMM.…”

Section: Introductionmentioning

confidence: 99%

Investigation of machining accuracy of micro-dimples fabricated by modified microscale pattern transfer without photolithography of substrates

Zhang

et al. 2015

Int J Adv Manuf Technol

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Micro-dimples are among the basic microfeatures that have been applied to different products in various fields. The product performance and service life of textured surfaces are directly affected by size, location, and density. A modified microscale pattern transfer process without photolithography of substrates, through the use of movable dry-film mask electrochemical micromachining, has been proposed for the production of micro-dimples. This paper investigates the influence of electrochemical micromachining parameters, namely, applied voltage and machining time on the machining accuracy of micro-dimples produced using this technique. Experimental results indicate that the machining accuracy deteriorates with prolonged machining time and increasing applied voltage. It is found that to obtain high machining accuracy when machining micro-dimples of similar depth, a combination of higher current density with reduced machining time is recommended.

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Surface micro-texturing of metallic cylindrical surface with proximity rolling-exposure lithography and electrochemical micromachining

Cited by 49 publications

References 35 publications

Removal of islands from micro-dimple arrays prepared by through-mask electrochemical micromachining

Removal of islands from micro-dimple arrays prepared by through-mask electrochemical micromachining

Sandwich-like electrochemical micromachining of micro-dimples

Investigation of machining accuracy of micro-dimples fabricated by modified microscale pattern transfer without photolithography of substrates

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