Surface metallization of PTFE and PTFE composites by ion implantation for low-background electronic substrates in rare-event detection experiments

Commercial-Grade Dielectrics Surface Metallization by Direct Laser Deposition from Deep Eutectic Solvents

“…18 The direct metallization of PTFE surfaces is considered challenging and has received limited attention in the literature. 12 Nobuyuki et al 19 plasma deposition at atmospheric pressure, but the electrical properties of the synthesized material were not investigated. Direct laser writing (DLW) has demonstrated flexibility and effectiveness, particularly in its ability to produce sophisticated and complex structures with high reproducibility.…”

“…Polyimide (PI) and fiberglass (FR-4) are widely used as substrates for electronic components, and the metallization of these materials is a well-developed industrial process. , However, the deposition of metal structures onto the surface of polytetrafluoroethylene (PTFE) presents a significant challenge to the scientific community due to its high chemical inertness and poor adhesion of metals to its surface. − Nonetheless, PTFE and related fluoropolymers hold great potential in specific microelectronics applications owing to their aforementioned inertness and exceptional dielectric properties, including an extremely low dielectric constant and dielectric loss. , These properties are particularly valuable in rare-event detection and underground low-background experiments, as they effectively preserve signal integrity . PTFE-based electronic substrates play a crucial role in lowering the detection limit of detectors and scintillation calorimeters for dark matter and neutrino double beta decay detection …”

Study on the preparation of low-background flexible electronics substrate based on ion beam modification polymer surface

“…Polytetrafluoroethylene (PTFE) is not only widely recognized for its low background, but it also serves as the base layer of FES with the least adhesive force [2]. We previously published the preparation of FES based on different ions modified PTFE [3,4]. To solve the problem of poor surface adhesion, this paper proposes a new method for analyzing the surface adhesion of polymers, which provide direct insight into the influence of ion implantation on the polymer surface adhesion.…”

“…ion implantation (PTFE and FEP)[3] 8 keV Nickel ion implantation (PTFE and PTFE-composite film)[4] SRIM simulationNuc. Stopping Power = 48 eV/nm Elec.…”

Fabrication of copper patterns on industrial-used dielectric substrates by direct laser metallization from deep eutectic solvents

“…The polyimide and fiberglass are used widely as substrates for electronic components in various applications [10,11], while the fabrication of metal structures on the surface of polytetrafluoroethylene (PTFE) is a challenge to the scientific world, due to the high chemical resistance and poor adhesion of metals to this surface [12,13,14]. However, the advantages of PTFE application in the field of printed circuit board (PCB) fabrication for ultra-high frequency electronics are undisputable due to its high damage resistance.…”