In this study, we developed a method for the fabrication of electrically conductive copper patterns of arbitrary topology and films on dielectric substrates, by improved laser-induced synthesis from deep eutectic solvents. A significant increase in the processing efficiency was achieved by acceptor substrate pretreatment, with the laser-induced microplasma technique, using auxiliary glass substrates and optional laser post-processing of the recorded structures; thus, the proposed approach offers a complete manufacturing cycle, utilizing a single, commercially available, pulsed Yb fiber laser system. The potential implications of the presented research are amplified by the observation of laser-induced periodic surface structures (LIPSSs) that may be useful for the further tuning of tracks’ functional properties.

In this study, we show the possibilities of developing a method for manufacturing electrically conductive copper patterns of arbitrary topology on various dielectric substrates by laser-induced synthesis from deep eutectic solvents. The possibility of printing on the industrially demanded dielectrics is shown, e.g., on polyimide, fiberglass plastic, and polytetrafluoroethylene (PTFE) substrates. The geometric and electrical properties of the resulting structures, as well as their composition, have been studied. The influence of the substrate material is shown to be substantial for the effective rate of formation of structures and their final properties.