“…The κ of Ag-flake-epoxy was similar to the values (0.58-1.7 W m −1 K −1 ) of other Ag-epoxy composites in the literature (Ag = 35-45 vol%) [6,8] demonstrating the reliability of synthesis and characterization methods. The enhancement factor (η) was 26.71 at nAgMWNTs = 2.3 vol% where η = (κ nAgMWNT-Ag-flake-epoxy − κ Ag-flake-epoxy )/κ Ag-flake-epoxy .…”
Section: −1supporting
confidence: 75%
“…[19,27,28] The electrical and thermal transport properties of nAg-MWNT-Ag-flake-epoxy and Ag-flake-epoxy TIMs are compared as a function of the curing duration ( Figure 3). As shown in Figure 3a, the σ of nAgMWNT-Ag-flake-epoxy TIMs was [3] orange open up-pointing triangle (silver nanoparticle 45 vol%), [6] blue open down-pointing triangle (aluminum nitride 74 vol%), [7] dark cyan open diamond (iodine-treated silver 35 vol%), [8] wine open star (silver epoxy plus graphene 5 vol%), [9] violet open pentagon (copper nanowire arrays 25 vol%), [10] magenta open left-pointing triangle (graphite 25 vol%), [11] dark yellow open right-pointing triangle (aligned MWNT 16.7 vol%), [12] navy open hexagon (MWNT 25 vol% plus graphene 25 vol%), [13] pink open inverted triangle (silver 70 vol% plus MWNT 3.1 vol%). [33] Half-filled symbols: olive half-filled pentagon (boron nitride nanosheet 50 vol%), [34] purple half-filled hexagon (carbon nanosheet 33 vol%).…”
An ultrahigh thermal conductivity (κ = 160 W m(-1) K(-1) ) of thermal interface materials is achieved with a high enhancement factor (96). A small amount (2.3 vol%) of 1D multiwalled carbon nanotubes (MWNTs) with high κ constructs effective phonon transport pathways between microscale silver-flake islands, and a solid phonon transport junction is realized by the coalescence of silver nanoparticles pre-functionalized on the MWNTs.
“…The κ of Ag-flake-epoxy was similar to the values (0.58-1.7 W m −1 K −1 ) of other Ag-epoxy composites in the literature (Ag = 35-45 vol%) [6,8] demonstrating the reliability of synthesis and characterization methods. The enhancement factor (η) was 26.71 at nAgMWNTs = 2.3 vol% where η = (κ nAgMWNT-Ag-flake-epoxy − κ Ag-flake-epoxy )/κ Ag-flake-epoxy .…”
Section: −1supporting
confidence: 75%
“…[19,27,28] The electrical and thermal transport properties of nAg-MWNT-Ag-flake-epoxy and Ag-flake-epoxy TIMs are compared as a function of the curing duration ( Figure 3). As shown in Figure 3a, the σ of nAgMWNT-Ag-flake-epoxy TIMs was [3] orange open up-pointing triangle (silver nanoparticle 45 vol%), [6] blue open down-pointing triangle (aluminum nitride 74 vol%), [7] dark cyan open diamond (iodine-treated silver 35 vol%), [8] wine open star (silver epoxy plus graphene 5 vol%), [9] violet open pentagon (copper nanowire arrays 25 vol%), [10] magenta open left-pointing triangle (graphite 25 vol%), [11] dark yellow open right-pointing triangle (aligned MWNT 16.7 vol%), [12] navy open hexagon (MWNT 25 vol% plus graphene 25 vol%), [13] pink open inverted triangle (silver 70 vol% plus MWNT 3.1 vol%). [33] Half-filled symbols: olive half-filled pentagon (boron nitride nanosheet 50 vol%), [34] purple half-filled hexagon (carbon nanosheet 33 vol%).…”
An ultrahigh thermal conductivity (κ = 160 W m(-1) K(-1) ) of thermal interface materials is achieved with a high enhancement factor (96). A small amount (2.3 vol%) of 1D multiwalled carbon nanotubes (MWNTs) with high κ constructs effective phonon transport pathways between microscale silver-flake islands, and a solid phonon transport junction is realized by the coalescence of silver nanoparticles pre-functionalized on the MWNTs.
“…The accumulation of heat generated by LED chip can shorten its life, so improving the thermal conductivity of packaging material is one of the biggest challenges in the development of LED. Currently, most researches focused on adding particles such as Ag , SiC , BN , AlN , Al 2 O 3 , SiO 2 , ZnO , and Si 3 N 4 /glass fibers to the epoxy resin at different mixing ratios. The preparation processes of epoxy composites are similar among all above papers.…”
To improve the thermal conductivity of epoxy resin, tensile way was used to orient the molecular chain of epoxy resin with SiO 2 particles filled. In this article, SiO 2 /Epoxy composites which had approximately onedimensional lattice structure were prepared. The heat generated by LED chip rapidly passed along the direction of the one-dimensional orientation in SiO 2 /Epoxy composites. The results showed that the thermal conductivity of oriented composites increased with the increase of silica concentration and draw ratio (If S is the cross-sectional areas of composites at the mold outlet, S 0 is the cross-sectional areas of composites after molding set, and draw ratio is S/S 0 ). With the addition of 50 wt% SiO 2 to the epoxy resin, the thermal conductivity of oriented SiO 2 /Epoxy composites with the draw ratio of 4 was 0.873 W/m K, which was 2.55 times that of unoriented SiO 2 /Epoxy composites. And a thermal conductivity, 5.97 times that of the epoxy resin, was obtained with 80 wt% SiO 2 and the draw ratio of 4. Nevertheless, the relative permittivities of epoxy composites which had 50 wt% SiO 2 with the draw ratio of 4 are stable with increasing frequency. POLYM. COMPOS., 37:818-823,
“…The thermal conductivity of monolithic epoxy is about 0.1416 W/mK. 51,52 The thermal conductivity of graphene is as high as 5000 W/mK. 53–55 Figure 5.Dynamic mechanical properties: (a) storage modulus, (b) loss modulus, (c) Tan δ, and (d) alpha-relaxation temperature and values of storage modulus, loss modulus and Tan δ at alpha-relaxation temperature.…”
The influence of multi-layered nanostructured graphene as reinforcement on thermal and mechanical properties of epoxy-based nanocomposites has been studied. The maximum improvement in mechanical properties was observed at 0.1 wt%. The Young’s and flexural moduli increased from 610 MPa to 766 MPa (26% increase) and 598.3 MPa to 732.8 MPa (23% increase), respectively. The tensile and flexural strengths increased from 46 MPa to 65 MPa (43% increase) and 74 MPa to 111 MPa (49% increase), respectively. The mode-1 fracture toughness (K1C) and critical strain energy release rate (G1C) increased from 0.85 MPa.m1/2 to 1.2 MPa.m1/2 (41% increase) and from 631 J/m2 to 685 J/m2 (9% increase), respectively. The increase in fracture toughness is attributed to the obstruction of cracks by graphene layers. The reinforcing effect of nanostructured graphene was also manifested in dynamic mechanical properties. The storage modulus and alpha-relaxation temperature values significantly increased indicating the fine integration of NSG in epoxy chains. The thermal properties of nanocomposites were simulated which showed that graphene is very efficient in significantly increasing the scattering and dissipation of thermal flux.
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