Surface‐enhanced resonance Raman scattering in partially oxidized thin copper film

Abstract

Broad and low‐intensity Raman peaks are usually expected from nanocrystalline thin semiconductor films. The inherently weak Raman scattering phenomenon can be further deteriorated by unwanted background signals preventing the successful Raman analysis of an analyte. In this study, the resonant and surface‐enhanced Raman scattering techniques were combined to detect CuO and Cu2O phases in the partially oxidized nanocrystalline copper film that were otherwise undetectable. Heat treatment resulted in increased oxidation and phase transition from multiphase to single CuO phase that was in situ observed by temperature‐dependent Raman measurements. Detailed understanding of the film properties and substrate interaction was made by using several characterization techniques.

Stabilizing Cu0–Cu+ sites by Pb-doping for highly efficient CO2 electroreduction to C2 products

“…At a potential of −1.1 V vs. RHE, we cannot observe the CuO x characteristic peak at 525 cm −1 , indicating that Cu 2 O was reduced to Cu during the reaction. 55 Compared with the Cu 0 –Cu + structure, Cu 0 had a poor performance for C–C coupling. Therefore, the doping of Pb in the catalyst could stabilize the Cu 0 –Cu + structure and improve the catalytic performance for CO 2 -to-C 2 products.…”

Temperature Dependence of Stress and Optical Properties in AlN Films Grown by MOCVD

“…Figure 8 shows that the E U of the sample A, sample Aa, sample B and sample Ba are 0.27, 0.25, 0.23 and 0.18 eV, respectively. The decreasing trend in Eu values after annealing is due to improvement in crystal quality and increased long range order [ 56 ]. The lower Urbach energy indicate lower defect density in AlN on nano-patterned substrate, in agreement with Raman data.…”

Erosion behavior and mechanism of Cu-B4C composites under arc discharge in different atmospheres

“…In figure 5(c), the copper liquid is limited by the uniformly distributed B 4 C particles that cannot splash outward and forms an irregular morphology around the B 4 C after cooling. Enlarging In addition, the main characteristic peaks at 295 cm −1 , 343 cm −1 and 630 cm −1 can be attributed to CuO [35]. This result indicates that the B 4 C particles maintain a good structure without decomposition, while copper is oxidized after arc erosion.…”